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FUXINSEMI MBR0530T1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI MBR0530T1G
- Type
- FUXINSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- MBR0530T1G
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0226574438
- Current
- 500mA
- Diode
- Electronic Component
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MBR0530T1G 产品概述
一、产品简介
MBR0530T1G 是一款独立式肖特基势垒二极管，品牌为 FUXINSEMI（富芯森美），封装为 SOD-123。该器件专为低压快速整流和保护电路设计，具有低正向压降、快速响应和耐浪涌能力，适用于便携设备、电源管理和保护回路中的整流与反向保护应用。
二、主要电气参数
- 直流整流电流（IO）：500 mA（连续最大工作电流，需考虑散热）
- 反向耐压（VR）：30 V
- 正向压降（Vf）：约 430 mV @ 0.5 A（在典型测试条件下）
- 非重复峰值浪涌电流（Ifsm）：5.5 A（单次脉冲或短时浪涌能力，用于启动或短路条件）
- 工作结温范围：-55 ℃ 至 +125 ℃
三、封装与热管理
器件采用 SOD-123 小型封装，适合表面贴装工艺（SMT），占板面积小，便于高密度设计。由于该封装热阻相对较高，设计电路板时应：
- 在焊盘下方和周围增加铜箔面积以提高散热能力；
- 对连续 0.5 A 工作电流进行温升评估，必要时采取散热措施或降额运行；
- 注意回流焊工艺参数与封装耐温范围匹配，避免过热损伤。
四、典型应用场景
- 开关电源（整流／续流二极管）
- 电源反向保护与OR-ing电路（防止电池/电源反向连接）
- 电池充放电管理与便携式设备供电路径保护
- LED 驱动、小功率电源及通信设备的保护与整流
- 瞬态抑制与夹位电路（结合其他元件使用）
五、使用建议与注意事项
- 按照最大额定值进行设计：连续电流不超过 500 mA，峰值浪涌电流仅限短时及间隔较长的条件下使用；长期高频浪涌会降低器件寿命。
- 在高温环境下应采取降额策略，保证结温不超过 +125 ℃。
- 若需要更高电压或电流能力，应选择额定值更高的型号或并联/更换封装更大的器件，并考虑并联时的电流均流问题。
- PCB 布局时尽量缩短电流回路长度，增加焊盘和过孔铜量以降低热阻与压降。
六、可靠性与测试
MBR0530T1G 针对一般商用与工业温度范围进行了电气特性测试，包括正向压降、反向漏电、浪涌能力及热循环等项目。实际使用中建议在样机阶段进行如下验证：
- 温升测试（不同板热设计下的结温测量）
- 浪涌与短路情形下的可靠性测试（验证 Ifsm 对电路的影响）
- 负温度系数与长期热应力测试，评估封装与焊点完整性
七、总结
MBR0530T1G（SOD-123）作为一款低压、小体积的肖特基二极管，凭借约 430 mV 的低正向压降和 5.5 A 的短时浪涌能力，适合各类低功耗整流、反向保护及便携电源场景。合理的PCB散热设计与按额定值使用，可充分发挥其在高效能量转换与保护电路中的优势。若需更详细的电气曲线、封装尺寸或回流焊工艺建议，请参考厂方完整数据手册或联系供应商获取样片与技术支持。
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