WMSIC Electronic Components

FUXINSEMI S9014

ModelS9014
PackageSOT-23
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI S9014
Type
FUXINSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FUXINSEMI
Electronic Component
S9014
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0264480234
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
150MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S9014 产品概述

S9014(FUXINSEMI 富芯森美)为一款小功率NPN晶体管,采用SOT-23封装,面向便携式消费电子和通用信号处理场景。基于所给参数,该器件在低电流开关与中低频增益放大应用中表现良好,适用于体积受限电路板的信号放大、驱动及开关任务。

一、主要参数简介

  • 晶体管类型:NPN(单只,数量:1个)
  • 最大集电极电流 Ic:100mA
  • 集射极击穿电压 Vceo:45V
  • 耗散功率 Pd(SOT-23):200mW
  • 直流电流增益 hFE:1000(典型)
  • 特征频率 fT:150MHz
  • 集电极截止电流 Icbo:100nA
  • 集射极饱和电压 VCE(sat):约300mV(在指定条件下)
  • 射基极击穿电压 Vebo:5V
  • 工作温度范围:-55℃ ~ +150℃
  • 封装:SOT-23

二、产品特点

  • 高直流电流增益:hFE 达到典型值 1000,便于在低基极驱动条件下实现较大集电极电流放大,适合高灵敏度信号通道。
  • 宽电压耐受能力:Vceo 45V 能满足多数中等电压系统的安全裕量。
  • 高频性能良好:fT 150MHz 支持较高频段的小信号放大与开关应用。
  • 小型封装:SOT-23 体积小,便于高密度PCB布局和表面贴装生产。

三、典型应用

  • 低功耗开关与接口驱动(如继电器驱动的前级、晶体管级开关)
  • 小信号放大器:前置放大、传感器信号调理、音频前级等
  • 驱动小功率LED或光耦输入端
  • 高频信号整形与电平转换

四、引脚排列与封装建议

SOT-23 三引脚封装,常见引脚排列为(从封装顶面视角):1=基极(B)、2=集电极(C)、3=发射极(E)。在实际设计中,请参照厂商封装图与PCB footprint,确保焊盘尺寸与热孔设计以改善散热。

五、使用注意事项与布局建议

  • 耗散功率受封装和PCB散热影响显著,200mW为参考值,请在高环境温度下保证足够的热余量。
  • Vebo 仅为 5V,应避免基极对发射极施加超过此值的反向电压,防止射极-基极击穿。
  • 在高增益(hFE 大)应用时注意基极偏置与温度稳定性,必要时并联偏置电阻或采用温度补偿措施以避免自激或漂移。
  • 布局上应尽量缩短基极与输入源间走线,增加旁路电容以抑制高频振荡。

若需器件封装图、典型应用电路或可靠性数据,可提供更详细的资料供设计验证。

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