WMSIC Electronic Components

FUXINSEMI 1SMB5919BT3G

Model1SMB5919BT3G
PackageSMB(DO-214AA)
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI 1SMB5919BT3G
Type
FUXINSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FUXINSEMI
Electronic Component
1SMB5919BT3G
Electronic Component
1
Package
SMB(DO-214AA)
Electronic Component
Zener Diode
Electronic Component
0.186g
Electronic Component
1
(Zzk)
250Ω
(Zzt)
2Ω
Electronic Component
BM0227791058
Diode
1
Current(Ir)
5uA@3V
Power Dissipation(Pd)
550mW
Electronic Component
5.32V~5.88V
Electronic Component
65℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SMB5919BT3G 产品概述

一、产品简介

1SMB5919BT3G 是一款独立式稳压二极管(Zener Diode),标称稳压值为 5.6V,适用于需要低电流电压基准或过压/浪涌钳位保护的场合。该器件由 FUXINSEMI(富芯森美)生产,采用 SMB(DO-214AA)表面贴装封装,便于自动化贴装与大批量生产。器件在-65℃~+150℃的结温范围内可靠工作,适应宽温环境要求。

二、主要电气参数

  • 稳压值(标称):5.6V
  • 稳压范围:5.32V ~ 5.88V
  • 反向电流 Ir:5 µA @ 3.0V(低漏电流特性)
  • 阻抗 Zzk:250 Ω(低电流区或转折区阻抗指标)
  • 阻抗 Zzt:2 Ω(在测试电流下的动态阻抗,表征稳压性能好)
  • 耗散功率 Pd:550 mW(在指定散热条件下的最大耗散功率)
  • 工作结温范围:-65℃ ~ +150℃
  • 配置:独立式二极管(单个元件,不包含并联或组合结构)

以上参数说明该型号在低到中等功耗、需要稳压或钳位的应用中具有良好的电压稳定性与低漏电流特性。

三、封装与热特性

  • 封装类型:SMB(DO-214AA),适用于表面贴装技术(SMT)。
  • 封装优点:体积适中、机械强度高、便于自动化贴装与焊接;相对于更小封装(如SOD-123)具有更好的功率散热能力。
  • 热管理建议:器件额定耗散功率为 550 mW,实际应用中应根据PCB铜箔面积和环境温度对功率进行降额(derating)。长时间连续工作时,建议留有足够的散热路径并避免在高温环境下满载运行,以延长可靠性。

四、关键特性与优势

  • 稳压精度较好:稳压范围 5.32V–5.88V,适合作为 5.6V 参考/稳压源。
  • 低动态阻抗:Zzt = 2 Ω 表明在测试工作电流下稳压特性良好,输出电压随电流变化小。
  • 低反向漏电流:Ir = 5 µA @ 3.0V,适合对待机功耗或微弱电流敏感的电路。
  • 宽温度适应性:-65℃ 至 +150℃,可用于工业级和较苛刻环境。
  • SMB 封装:易于SMD生产,兼顾机械与热性能。

五、典型应用场景

  • 稳压参考:作为 5.6V 的简单稳压单元或电压参考源,用于传感器、控制电路等。
  • 过压保护与钳位:在输入或信号线上对瞬态过压进行钳位保护,防止后级电路损坏。
  • 浪涌抑制:与限流元件配合用于电源浪涌吸收、稳压环前端保护。
  • 便携与低功耗设备:低漏电流特性有利于延长待机时间或降低静态功耗。

六、使用建议与注意事项

  • 功率与降额:550 mW 为器件在推荐条件下的最大耗散功率,实际电路中应考虑典型工作电流与PCB散热,采取适当降额策略(例如在高温或狭小铜箔下减少允许电流)。
  • 电流限制:稳压二极管通常作为并联(分流)稳压元件使用,应配合串联限流电阻或电流源,以限制流经二极管的电流不超过安全范围。
  • 焊接工艺:遵循 SMB/DO-214AA 的回流焊工艺参数,避免过高温度或过长时间的热冲击。
  • 环境与可靠性:为保证长期可靠性,避免在高湿、腐蚀性环境直接使用,必要时采用涂覆或密封处理。
  • 测试与筛选:在关键应用中,建议按设计电流下测量稳压值与漏电流以进行必要的筛选或校准。

七、订购与合规性

  • 品牌:FUXINSEMI(富芯森美)
  • 封装:SMB(DO-214AA)
  • 型号:1SMB5919BT3G
    在批量采购与设计替换时,应向供应商确认器件的最新版本、封装图和可靠性数据(如加速老化、ESD 耐受值等),并确保符合项目的质量和认证要求(如 RoHS 等)。

如需进一步的电气特性曲线、封装尺寸图或应用电路示例,我可以帮您提供更详细的资料与实用建议。

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