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FUXINSEMI DSK16
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI DSK16
- Type
- FUXINSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- DSK16
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Electronic Component
- BM0264480217
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 500uA
- (Vf)
- 700mV@1A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DSK16（肖特基二极管）产品概述
一、主要参数与性能
DSK16 是富芯森美（FUXINSEMI）推出的一款低压降肖特基整流二极管，面向通用整流与保护应用。关键参数如下：
- 正向压降：Vf ≈ 0.70V @ If = 1A
- 额定直流整流电流：If = 1A
- 反向耐压：Vr = 60V
- 反向泄漏电流：Ir ≤ 500 μA（典型值随温度与逆向电压上升）
- 非重复峰值浪涌电流：Ifsm = 30A（短时脉冲）
- 工作结温：Tj = -55℃ ～ +125℃
- 封装：SOD-123（表面贴装）
DSK16 在 1A 级别应用中保持较低的正向压降与较高的浪涌能力，适合对效率与抗冲击有一定要求的场合。
二、封装与热特性
SOD-123 小型表贴封装便于高速贴装与紧凑 PCB 布局。尽管封装体积小，但在 1A 连续工作时需注意结到环境的散热能力：
- 建议在 PCB 上放置较短的铜箔热散区域，并增加过孔与散热铜地或散热岛以降低结温。
- 在高脉冲或高环境温度下，应评估结温并考虑降额使用以延长寿命。
三、典型应用场景
- 开关电源整流与续流保护（低压输出侧）
- 反向极性保护与电源取反保护（汽车电子、工业设备）
- 二次整流、续流二极管与稳压电路中的快速开关/钳位元件
- 电池充放电路径、二极管 OR-ing 供电方案
四、使用注意事项与布板建议
- 反向泄漏随温度显著上升，若电路对待机电流敏感，应在系统级评估泄漏对能耗的影响。
- 为保证最大浪涌能力，器件应有足够的焊盘热容量与短走线，避免热聚集。
- 回流焊推荐按照 SMD 常规温度曲线进行，避免长时间在高温区滞留以保护封装与内部焊接。
- 对于高频开关应用，注意寄生电感与布局，尽量缩短二极管与开关器件之间的回路路径。
五、可靠性与测试建议
DSK16 满足工业级工作温度范围，适合长期运行。出厂前通常经过整流测试、稳态热循环与浪涌冲击测试。设计时建议进行以下验证：
- 在目标系统环境下做过载和浪涌测试，确认 Ifsm 与重复脉冲承受能力；
- 在高温条件下测量 Ir，以评估待机与泄漏电流对系统的影响；
- 做热阻（θJA）和结温监测，确定降额系数。
六、选型与采购建议
选择 DSK16 时，若系统对静态泄漏极为敏感，应与供应商确认 Ir 在不同 Vr 与温度下的典型曲线。封装为 SOD-123，适合自动贴装生产。购买时请注明品牌 FUXINSEMI（富芯森美）与型号 DSK16，并索取完整数据手册以获得详细电气特性、典型曲线与封装尺寸图纸。
DSK16 以其紧凑封装、良好的浪涌能力与 60V 反向耐压，适合多种中低压整流与保护应用，是需要在体积受限场合保证可靠整流与抗冲击性能的实用选择。
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