Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FUXINSEMI SS104C
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI SS104C
- Type
- FUXINSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- SS104C
- Electronic Component
- 1
- Package
- SMC(DO-214AB)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.35g
- Electronic Component
- 1
- Electronic Component
- BM0264480224
- Current
- 10A
- Diode
- Electronic Component
- Current(Ir)
- 500uA@40V
- (Vf)
- 550mV@10A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS104C 产品概述
一、产品简介
SS104C 为富芯森美（FUXINSEMI）推出的一款独立式肖特基二极管，封装为 SMC (DO-214AB)。器件针对高电流整流与续流应用优化，正向压降低、浪涌能力强，适用于中低电压电源系统与功率模块。典型工作结温范围为 -55℃ 至 +150℃，适应宽温度工况下的稳定工作。
二、主要电气参数
- 二极管类型：肖特基（独立式）
- 正向压降：Vf = 550 mV @ IF = 10 A
- 额定整流电流：IF(AV) = 10 A
- 直流反向耐压：VR = 40 V
- 反向漏电流：IR = 500 µA @ VR = 40 V
- 非重复峰值浪涌电流：IFSM = 200 A
- 工作结温：Tj = -55℃ ~ +150℃
- 封装：SMC (DO-214AB)
三、主要特性与优势
- 低正向压降：在大电流条件下能有效降低导通损耗与发热，提升系统效率。
- 极低反向恢复：肖特基结特性使反向恢复时间极短，适合高频开关应用，降低开关损耗与电磁干扰。
- 强浪涌承受能力：200 A 峰值浪涌电流，适用于启动或短时过载场景。
- 宽温度适应性：工作结温范围宽，可靠性高，适配工业级环境。
- SMC 封装：体积适中，PCB 布局友好，具有良好散热路径与机械强度。
四、典型应用场景
- 开关电源（SMPS）输出整流与续流二极管
- DC-DC 降压/升压模块整流
- 电池充放电保护与电源路径管理
- 逆变器、太阳能逆变及能量回收系统（在符合电压等级范围内）
- 工业与消费类电子的整流与防反接保护
五、封装与热管理建议
SMC (DO-214AB) 提供较好的散热性能，但在高电流连续工作时仍需注意 PCB 散热设计：
- 扩大铜箔散热面积、增加过孔直达内层或底层散热区；
- 为保证长期可靠性应考虑适度降额使用；
- 注意器件引脚与焊盘的热阻匹配，避免局部过热导致漏电流上升或热失控。
六、使用注意事项
- 反向漏电随温度显著上升，设计时应考虑高温下的漏电与功耗变化；
- 在选型替换时确认封装、引脚排列及电气参数兼容；
- 在有较大浪涌或反复冲击的场合，评估器件热冲击及寿命；
- 焊接与回流工艺应遵循封装热限，避免超温损伤。
本产品适合对效率、开关性能及浪涌承受有较高要求的中低压电力电子场合。如需详细的电气曲线、热阻参数或封装尺寸图，建议联系富芯森美技术支持获取完整数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
