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FUXINSEMI 2SA1013-Y 2SA1013
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI 2SA1013-Y
- Type
- FUXINSEMI
- Minimum package
- 1000 卷
Technical parameters
- Electronic Component
- FUXINSEMI
- Electronic Component
- 2SA1013-Y
- Electronic Component
- 1
- Package
- SOT-89
- Electronic Component
- 1 PNP
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.14g
- Electronic Component
- 1
- Electronic Component
- BM0257672712
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- PNP
- Frequency(f T)
- 15MHz
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
- Collector Current(Ic)
- 1A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
2SA1013-Y 产品概述
一、主要性能
2SA1013-Y 为 FUXINSEMI（富芯森美）推出的一款 PNP 小功率硅双极型晶体管。器件在 SOT-89 封装中提供，主要电气参数如下：集电极电流 Ic 最大 1A，集-射极击穿电压 Vceo = 160V，耗散功率 Pd = 500mW（环境温度依封装及散热条件需降额使用），直流电流增益 hFE 在 Ic=200mA、VCE=5V 时可达 320；特征频率 fT ≈ 15MHz，集电极截止电流 Icbo≈1μA，集电极饱和电压 VCE(sat) 在规定驱动条件下约 1.5V（例如 Ic=500mA、Ib=50mA 时作为参考），射-基极反向击穿 Vebo=6V。工作温度范围为 -55℃ 到 +150℃。
二、典型应用场景
2SA1013-Y 适合用于中低频模拟放大、信号放大器、线性稳压器中的串联元件、高侧开关及一般电源管理电路。凭借 160V 的耐压能力，可用于中高电压场合的开关或放大场景；fT 15MHz 表明其适用于音频到低射频带宽需求。
三、封装与散热考虑
SOT-89 为小型贴片封装，便于 PCB 紧凑布局，但热阻相对较大。器件额定功耗 500mW 在封装限制下对散热依赖明显，建议在 PCB 设计时：
- 提供宽铜箔散热区域及多层铜通孔；
- 保持良好空气流动或搭配散热片使用；
- 根据实际工作点进行功耗降额计算。
四、使用建议与注意事项
- 必须避免基极-射极反向电压超过 Vebo=6V，以免损伤结结构；基极驱动电路应加入限制。
- 如从放大区切换到饱和态，需增加基极驱动电流（饱和时常用的强制放大倍数 βsat≈10–20），例如在 Ic=200mA 时，按 hFE=320 可在放大区仅需 Ib≈0.63mA，但若要求饱和导通则需按更低的 β 计算 Ib。
- 注意 Icbo（漏电）随温度上升会增加，高温下电路偏置需考虑漏电影响。
- 由于 VCE(sat) 在高电流时仍可能较大（示例 1.5V），在功率敏感应用中需评估功耗与发热。
五、典型偏置示例
在放大区：若设计工作点 Ic=200mA，按 datasheet 给定的 hFE≈320，可使用基极电流 Ib ≈ 200mA / 320 ≈ 0.63mA 来设定偏置；若要求强饱和以降低开关损耗，按强制 β≈10，则需 Ib≈20mA（需确认驱动能力与封装允许的基极电流）。
六、产品选型提示
2SA1013-Y 适合追求高耐压与高增益的 PNP 小功率场合，但因封装与 Pd 限制，适用时应综合考虑工作电流、开关频率与散热措施。选型时建议结合实际电路工况，在 PCB 布局与热管理上做好预留，以保证长期可靠性。若需替代或配对，建议查阅相近参数的 PNP 器件并对比 Vceo、hFE、Pd 与封装热阻等指标。
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