WMSIC Electronic Components

GOODWORK ESD9B3.3ST5G

ModelESD9B3.3ST5G
PackageSOD-923
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK ESD9B3.3ST5G
Type
GOODWORK
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
ESD9B3.3ST5G
Electronic Component
1
Package
SOD-923
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
10pF
Electronic Component
BM0263571082
Operating Temperature
55℃~+150℃
Voltage
12.5V
Electronic Component
IEC 61000-4-2
Current(Ir)
500nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD9B3.3ST5G 瞬态抑制二极管产品概述

ESD9B3.3ST5G是固得沃克(GOODWORK) 推出的单路瞬态抑制二极管(TVS),专为3.3V供电系统的静电放电(ESD)及轻量级瞬态浪涌防护设计。该器件结合低电压匹配、低结电容、宽温可靠性等特点,适配高密度PCB布局与严苛环境应用,满足IEC 61000-4-2等国际防护标准,是消费电子、工业控制、物联网设备等领域的高性价比防护方案。

一、产品核心定位

ESD9B3.3ST5G聚焦3.3V系统的专用ESD防护,核心设计目标围绕三大方向:

  1. 精准电压匹配:针对主流3.3V供电电路(如MCU、传感器、高速接口),避免截止电压过高干扰电路功能或过低导致误触发;
  2. 信号完整性保障:通过低结电容设计,兼容高频数据总线(如USB、SPI、I2C),不影响信号传输质量;
  3. 严苛环境可靠性:覆盖宽温范围与国际防护标准,适配工业级、户外设备等极端应用场景。

二、关键电性能参数深度解析

该器件的电性能参数针对3.3V系统做了针对性优化,核心参数的实际意义如下:

1. 电压匹配与导通特性

  • 反向截止电压(Vrwm):3.3V:与3.3V电路工作电压完全一致,正常工作时器件处于反向截止状态,无额外漏电流或信号干扰;
  • 击穿电压(Vbr):4.3V:比截止电压高1V,确保在静电/浪涌触发时快速击穿导通(ns级响应),泄放瞬态电流;
  • 钳位电压(Vc):12.5V(Ipp=8A时):当峰值脉冲电流达到8A时,器件两端电压被限制在12.5V,远低于后端IC的典型耐压值(15V~20V),有效避免过压损坏。

2. 防护能力与功耗特性

  • 峰值脉冲功率(Ppp):100W(8/20μs脉冲):可承受100W的瞬态浪涌功率,满足轻量级浪涌防护需求(如电源瞬变、感应雷击);
  • 峰值脉冲电流(Ipp):8A:能泄放最大8A的瞬态电流,符合IEC 61000-4-2的ESD防护等级(接触放电8kV、空气放电15kV);
  • 反向漏电流(Ir):500nA(Vrwm下):低漏电流设计,不增加低功耗电路的静态功耗,适配电池供电设备(如物联网传感器)。

3. 信号兼容性设计

  • 结电容(Cj):10pF:低结电容是高频信号防护的关键,10pF的电容值可兼容100MHz以上的高速数据总线,避免信号上升沿失真、传输延迟等问题。

三、封装与可靠性设计

ESD9B3.3ST5G的封装与可靠性设计适配小型化与严苛环境需求:

1. 超小型表面贴装封装

采用SOD-923封装,尺寸约1.6mm×0.8mm×0.6mm(典型值),体积小、重量轻,适合智能手机、智能穿戴、小型传感器模块等高密度PCB设计,可大幅节省布局空间。

2. 宽温工作范围

工作温度覆盖**-55℃+150℃**,远超工业级应用的常规温度要求(-40℃+85℃),能在低温(如北方户外)、高温(如工业烤箱)环境下稳定工作,甚至可适配部分汽车级场景(需结合具体认证)。

3. 国际标准合规

符合IEC 61000-4-2静电放电防护标准,可承受接触放电8kV(Level 4)、空气放电15kV(Level 4),同时满足RoHS无铅环保要求,符合全球电子设备的环保法规。

四、典型应用场景

ESD9B3.3ST5G的应用场景覆盖多领域,核心场景包括:

  1. 消费电子接口防护:智能手机、平板、笔记本的USB端口、耳机接口、HDMI接口的ESD防护;
  2. 工业控制模块:PLC数字输入/输出口、工业传感器(温度、压力传感器)接口的静电与浪涌防护;
  3. 物联网设备:低功耗传感器节点、智能门锁、智能家居设备的3.3V供电电路防护;
  4. 车载电子适配场景:车载信息娱乐系统的USB接口、CAN总线接口的静电防护(需结合宽温可靠性验证)。

五、产品优势总结

相比同类3.3V ESD防护器件,ESD9B3.3ST5G具备以下核心优势:

  • 电压匹配精准:截止电压与3.3V工作电压完全一致,无额外电路损耗;
  • 高频兼容性强:10pF低结电容,适配高速数据总线,保障信号完整性;
  • 可靠性高:宽温范围、低漏电流、符合国际标准,适合严苛环境;
  • 小型化集成:SOD-923封装节省PCB空间,适配小型化设备设计。

综上,ESD9B3.3ST5G是一款专为3.3V系统设计的高性价比ESD防护器件,可有效解决静电放电与轻浪涌对电子设备的损坏问题,覆盖多领域应用场景,是电子设计中可靠的防护选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.