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GOODWORK K14
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- GOODWORK K14
- Type
- GOODWORK
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- GOODWORK
- Electronic Component
- K14
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0257623376
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 200uA@40V
- (Vf)
- 550mV@1A
- Electronic Component
- 65℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
K14 产品概述
一、主要特点
K14 是固得沃克（GOODWORK）推出的一款独立式肖特基二极管，封装为 SOD-123FL。该器件在 1A 条件下具有典型正向压降 Vf = 0.55V，低压降特性可显著降低整流损耗与发热。直流反向耐压 Vr = 40V，额定整流电流 1A，非重复峰值浪涌电流 Ifsm 可达 30A，适合处理短时浪涌能量。
二、电气参数（重点规范）
- 正向压降：Vf = 550 mV @ IF = 1 A（典型值）
- 直流反向耐压：Vr = 40 V
- 最大整流电流：IF(AV) = 1 A（独立式）
- 反向漏电流：IR = 200 μA @ VR = 40 V（随温度上升显著增加）
- 工作结温：Tj = -65 ℃ ～ +125 ℃
- 非重复峰值浪涌电流：Ifsm = 30 A（单次脉冲，遵循封装和热限制）
三、封装与热性能
SOD-123FL 小型封装便于高密度布板，适合空间受限的消费电子与通信设备。尽管为独立式器件，但在长时间 1A 工作或频繁浪涌场合需注意散热设计：建议靠近地铜或使用散热过孔增大铜箔面积以降低结温。正向损耗约为 0.55W（1A 条件），应结合 PCB 热阻评估结温上升。
四、典型应用场景
- 开关电源整流、自由轮二极管
- 5V/12V 电源轨保护与整流
- 电池管理与充电电路（用于低压差整流）
- 通信设备、仪器仪表中的防反接和浪涌抑制
其低 Vf 特性在需提高能效和降低发热的场合尤为有利。
五、使用建议
- 对于持续接近 1A 的工况，建议对电流进行热裕量设计并适当降额使用；在高环境温度下应考虑额定电流下降。
- 反向漏电流 IR 随温度上升快速增加，若电路对微弱漏电敏感（如待机电路），需评估在高温条件下的影响。
- 务必遵循推荐回流焊工艺（参考 SOD-123FL 封装的热曲线），避免超温或长时间过热影响器件可靠性。
- 对于经常出现高能量浪涌的场合，建议在电路中配合限流、抑制元件使用以保护器件。
六、可靠性与注意事项
K14 的工作结温范围宽 (-65℃ 至 +125℃)，适应恶劣环境。由于为肖特基结构，器件对静电敏感，建议在装配与测试过程中做好 ESD 防护。长期高温或反复大功率脉冲会加速老化，需在设计期进行充分的应力测试与寿命评估。
七、选型与订购信息
品牌：GOODWORK（固得沃克）
型号：K14（肖特基二极管，独立式）
封装：SOD-123FL
关键参数回顾：Vf 0.55V@1A，Vr 40V，IF 1A，IR 200μA@40V，Ifsm 30A，Tj -65~+125℃。
在选型时请根据实际环境温度、最大连续电流与浪涌要求确认是否需降额或改用更高 Vr/Ifsm 规格的器件。
如需获取完整数据手册（包括电气曲线、热阻、封装尺寸与推荐 PCB 过孔布局），建议向供应商索取最新版规格书并结合样片进行验证测试。
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