WMSIC Electronic Components

GOODWORK 2N3906

Model2N3906
PackageSOT-23
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK 2N3906
Type
GOODWORK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
2N3906
Electronic Component
1
Package
SOT-23
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0257623403
Operating Temperature
55℃~+150℃
Transistor Type
PNP
Frequency(f T)
300MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2N3906 小信号 PNP 晶体管(GOODWORK 固得沃克,SOT-23)产品概述

一、简介

2N3906 是一款通用型小信号 PNP 晶体管,适用于开关和低功率放大电路。该款由 GOODWORK(固得沃克)提供,SOT-23 封装体积小、便于表面贴装,常用于便携设备、信号处理和驱动电路。凭借较高的直流增益和较快的特征频率,2N3906 在射频前端、模拟放大与数字接口电路中表现良好。

二、主要参数

  • 集电极电流 Ic:200 mA
  • 集射极击穿电压 Vceo:40 V
  • 最大耗散功率 Pd:200 mW
  • 直流电流增益 hFE:300(在 Ic = 10 mA、VCE = 1 V 时)
  • 特征频率 fT:300 MHz
  • 集电极截止电流 Icbo:100 nA
  • 集电极饱和电压 VCE(sat):300 mV(在 50 mA 与 5 mA 条件下)
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 发射极-基极击穿电压 Vebo:5 V
  • 品牌:GOODWORK(固得沃克)
  • 封装:SOT-23

三、特性与优势

  • 高电流增益:在中小电流工作点(Ic ≈ 10 mA)下 hFE 高达 300,便于低功耗偏置下实现较大放大倍数。
  • 宽频带:fT ≈ 300 MHz,适合高频小信号放大与快速开关应用。
  • 低饱和压降:VCE(sat) ≈ 300 mV(典型),在开关导通时损耗较小。
  • 低漏电流:Icbo ≈ 100 nA,有利于高阻输入电路的稳定性与低温漂。
  • 宽温度范围:-55 ℃ 到 +150 ℃,适应工业级环境。

四、典型应用

  • 小信号放大器(反向放大、共射或共基配置)
  • 低压驱动与逻辑电平转换(与 NPN 器件配对)
  • 高速开关与脉冲电路
  • 射频前端的缓冲与混合电路(低至 VHF/低 UHF)
  • 电源管理中的低侧/高侧控制电路(注意电压及功耗限制)

五、使用建议与注意事项

  • 功耗限制:封装耗散功率 Pd = 200 mW,注意在较高电流或较高 VCE 条件下可能超出封装热限制,应根据 PCB 散热与环境温度计算安全工作点。
  • 安全电压:Vceo = 40 V,电路设计时应预留足够裕量,避免逆偏或瞬态冲击导致击穿。
  • 基极保护:Vebo = 5 V,基极-发射极间承受的反向电压有限,需避免超过该值以防损坏。
  • 饱和区驱动:若用于开关导通,注意保持基极驱动电流以确保低 VCE(sat),但同时要保证基极功率与器件温升在允许范围内。
  • 静电防护与焊接:SOT-23 封装需注意静电敏感性,焊接温度与时间应符合厂商推荐回流曲线,防止封装或芯片应力损害。

六、封装与采购

  • 封装:SOT-23,适于自动贴装生产与密集 PCB 布局。
  • 品牌信息:GOODWORK(固得沃克),提供工业级温度范围与一致性良好的小信号特性。
  • 选型提示:若需要更高功耗能力或更大电流能力,可考虑更大封装或功率级别的替代器件;若需要 NPN / PNP 配对,可配合 2N3904 使用以获得对称性能。

如需具体的温度特性曲线、极限值和封装尺寸图(PCB land pattern),或在特定电路中的偏置计算实例,可提供电路条件后进一步给出详细设计建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.