Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
GOODWORK SS110
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- GOODWORK SS110
- Type
- GOODWORK
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- GOODWORK
- Electronic Component
- SS110
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.095g
- Electronic Component
- 1
- Electronic Component
- BM0257623379
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 200uA
- (Vf)
- 850mV@1A
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS110 产品概述
一、产品简介
SS110 是一款独立式肖特基二极管，由 GOODWORK（固得沃克）生产，采用 SMA (DO-214AC) 封装。肖特基结构赋予其低正向压降与快速开关特性，适用于中低功率整流与保护场景。器件定位为 1A 连续整流能力的通用肖特基二极管，兼顾体积紧凑与良好热稳定性。
二、关键参数
- 型号：SS110
- 封装：SMA (DO-214AC)，独立式（Discrete）
- 正向压降：Vf = 850 mV @ If = 1 A
- 直流反向耐压：Vr = 100 V
- 连续整流电流：If = 1 A
- 反向电流：Ir = 200 μA（常温条件下）
- 非重复峰值浪涌电流：Ifsm = 30 A
- 工作结温范围：Tj = -65 ℃ ～ +150 ℃
- 品牌：GOODWORK（固得沃克）
三、电气与热性能要点
肖特基结使得在 1 A 工作点时正向压降低（≈0.85 V），可以减少整流损耗和升温；同时由于肖特基二极管本质，反向漏电流随温度上升显著增加，设计时需考虑高温下的漏电容忍度与热结温度限制。Ifsm = 30 A 表明器件可承受短时浪涌（如开机充电或浪涌脉冲），但不宜作为长期过载使用。
四、封装与安装
SMA (DO-214AC) 封装体积紧凑，适合表面贴装或波峰/回流焊工艺。为保证 1 A 连续功率散热，建议在 PCB 上使用较大铜箔散热区并通过热孔或散热铜箔扩展散热路径。具体焊盘尺寸与回流曲线请参照厂家数据手册与行业标准。
五、典型应用场景
- 开关电源整流与续流二极管
- 反接保护与极性保护电路
- 电池充放电路径的低损耗路径
- 车载与工业电源中对体积和效率有要求的场合（在满足漏电流与温度限制下）
- DC-DC 变换器、降压模块的输出整流
六、使用建议与注意事项
- 高温下反向电流显著上升，设计时需留有余量并进行温度仿真或测试；长期在高结温下工作会缩短寿命。
- 对于连续较大电流或散热受限的应用，考虑使用更大封装或并联器件（并联需注意电流均衡）。
- 浪涌能力虽高，但避免频繁大幅浪涌冲击。
- 焊接与回流过程应遵循 GOODWORK 提供的工艺规范，避免超温损伤封装或引脚。
七、品牌与质量
GOODWORK（固得沃克）作为供应商，提供工业级温度范围（-65 ℃ 到 +150 ℃）与可靠性支持。选型时建议索取并阅读完整数据手册与典型特性曲线，进行样机验证以确保满足目标应用的电气与热工况要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
