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GOODWORK 2N5551
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- GOODWORK 2N5551
- Type
- GOODWORK
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- GOODWORK
- Electronic Component
- 2N5551
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0263571088
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- NPN
- Frequency(f T)
- 300MHz
- Power Dissipation(Pd)
- 300mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
2N5551 产品概述
一、主要参数概览
2N5551（GOODWORK 封装：SOT-23）为高压小信号NPN晶体管。关键参数包括：集电极电流 Ic 最大 600mA，集-射击穿电压 Vceo 160V，耗散功率 Pd 300mW，直流电流增益 hFE 约 80，特征频率 fT 约 300MHz，集电极截止电流 Icbo 50nA，集射极饱和电压 VCE(sat) 150mV，射-基击穿电压 Vebo 6V，工作温度范围 -55℃ 至 +150℃。单片数量：1 个 NPN。
二、器件特性与优势
- 高耐压：160V 的 Vceo 使其在高压小信号场合具有良好可靠性，适合高电压前级放大或开关应用。
- 高频性能：fT ≈ 300MHz，适用于 VHF 及一般射频放大器或缓冲级。
- 低漏电：Icbo 仅 50nA，适用于高阻抗电路、精密信号放大。
- 低饱和压：VCE(sat) ≈150mV，有利于开关时降低功耗与压降。
- SOT-23 封装，体积小、适合表面贴装与批量生产。
三、典型应用场景
- 小信号放大电路：输入级、前置放大器、低噪声放大（注意配合偏置与阻抗匹配）。
- 开关电路：低压饱和开关、驱动小负载或作为逻辑接口。
- 振荡与混频电路：利用其较高 fT 设计本振或缓冲放大器。
- 通信设备、传感器前端、便携式电子产品等。
四、封装与引脚说明
器件为 SOT-23 小封装，适合表面贴装工艺。不同厂商封装的引脚排列可能有所差异，使用前请参考 GOODWORK 提供的封装图与引脚定义以确认 B、C、E 排列。
五、选型与使用建议
- 热管理：Pd 仅 300mW，SOT-23 限制了散热能力，长时间高电流工作需注意功率耗散与热阻，必要时采用降额工作或外部散热措施。
- 电流限制：尽管 Ic 标称可达 600mA，实际连续大电流应用需注意结温上升与 SOA（安全工作区）限制，建议在设计中留足裕量。
- 偏置与 hFE：hFE 随 Ic、温度变化明显，放大电路应采用稳偏电路或反馈以保证增益稳定。
- 耐压与极限：Vebo ≈ 6V，基极不能承受过高反向电压；避免在基极-发射极反向击穿条件下使用。
六、典型电路参考与注意事项
用于共射放大时注意耦合电容与偏置网络；用于开关时应并联保护二极管或限流元件以防感性负载回冲。RF 应用需做好阻抗匹配与寄生参数控制。
七、可靠性与环境适应性
工作温度范围宽（-55℃～+150℃），适合工业级与严苛环境应用。建议在高温或高湿环境下进行老化与应力测试以验证长期可靠性。
总结：GOODWORK SOT-23 版 2N5551 以其高耐压、高频特性与低漏电优势，适用于多种放大与开关场合，但在高功耗或高连续电流应用时需重视热管理与 SOA 限制。
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