WMSIC Electronic Components

GOODWORK ES1D

ModelES1D
PackageSMA(DO-214AC)
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK ES1D
Type
GOODWORK
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
ES1D
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.088g
Electronic Component
1
Electronic Component
BM0211384333
Current
1A
Diode
1
Current(Ir)
5uA@200V
(Vf)
950mV@1A
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ES1D 产品概述

一、产品简介

ES1D 是一款高效率、快恢复的独立式整流二极管,由 GOODWORK(固得沃克)提供,封装为 SMA(DO-214AC)。该器件针对开关电源、适配器、整流与续流回路等场景优化,兼顾低正向压降与较短反向恢复时间,适用于中功率、高开关频率的电源系统。

二、主要性能与参数

  • 正向压降(Vf):950 mV @ IF = 1 A(典型值),降低功耗并提升系统效率。
  • 直流反向耐压(Vr):200 V,适合200V级整流应用。
  • 反向电流(Ir):5 μA @ VR = 200 V(典型),有利于降低漏电及待机损耗。
  • 反向恢复时间(Trr):35 ns(典型),快速恢复特性减少开关损耗与电磁干扰。
  • 连续整流电流:1 A,适用于轻中功率整流场合。
  • 工作结温范围(Tj):-65 ℃ 至 +150 ℃,适应宽温度工作环境。

三、封装与热性能

ES1D 采用 SMA(DO-214AC)独立式封装,具备良好的焊接性能与散热路径。封装体积小、易于自动化贴装,适合紧凑设计。建议在电路板上提供适当的铜箔散热区域以提升热稳定性,保证在接近额定电流条件下长时间可靠工作。

四、典型应用场景

  • 开关电源(SMPS)二次整流与续流二极管。
  • 适配器与充电器输出整流。
  • 电机驱动与逆变器的续流保护。
  • 工业控制与照明驱动电源中的整流与钳位电路。
  • 其他要求低 Vf、低 Ir 和较快 Trr 的功率电子应用。

五、可靠性与使用注意

  • 建议遵循器件最大额定值,避免在高于额定 Vr 或长时间接近 Tj 上限工作。
  • 焊接时遵守 SMA 封装的回流温度曲线,避免超时高温导致封装或焊点失效。
  • 在高开关频率应用中,注意与电路的寄生电感、电容配合,尽量减小过冲与振铃,配合合适的缓冲网络以降低 EMI。
  • 存储与使用环境应避免潮湿与腐蚀性气体,必要时按 JEDEC 湿敏等级处理。

六、订购与品牌信息

产品型号:ES1D;品牌:GOODWORK(固得沃克);封装:SMA(DO-214AC)。如需获取详细数据手册(含最大额定值、典型曲线、封装尺寸及回流曲线)、样品或批量采购支持,请与 GOODWORK 供应渠道联系,按应用条件选择合适的测试与配套方案。

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