Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
GOODWORK K54
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- GOODWORK K54
- Type
- GOODWORK
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- GOODWORK
- Electronic Component
- K54
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.08g
- Electronic Component
- 1
- Electronic Component
- BM0263571083
- Current
- 5A
- Diode
- Electronic Component
- Current(Ir)
- 100uA
- (Vf)
- 550mV@5A
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
K54 产品概述
一、产品简介
K54 系列是 GOODWORK（固得沃克）推出的一款 SOD-123FL 封装肖特基整流二极管。该器件为独立式二极管，专为高效率电源整流与保护场景设计，兼顾低压降、高电流能力与良好的浪涌耐受性，适用于电源适配器、安防电子、绿色照明、家用电子、户外设备、通讯产品及工业控制等多种应用场景。
二、主要电气参数
- 二极管配置：独立式
- 正向压降（Vf）：550 mV @ 5 A
- 直流反向耐压（Vr）：40 V
- 最大整流电流（Io）：5 A（直流）
- 反向漏电流（Ir）：100 μA（典型/上限规格，随温度上升可能增加）
- 非重复峰值浪涌电流（Ifsm）：100 A
- 工作结温范围：-65 ℃ ~ +150 ℃
三、产品特点与优势
- 低正向压降：在 5 A 工况下 Vf≈550 mV，可显著降低整流损耗与发热，有利于提高转换效率和整体系统能效。
- 良好浪涌承受力：Ifsm 100 A 能够应对开机浪涌与瞬态冲击，增强系统可靠性。
- 宽温度范围：支持 -65 ℃ 至 +150 ℃ 的工作结温，适合严苛环境与工业级应用。
- 紧凑封装：SOD-123FL 封装在体积受限的应用中具备较好的板级布局适配性，同时便于自动化贴装。
- 品牌与一致性：GOODWORK 系列产品在品质控制和一致性方面具有稳定表现，适合批量生产使用。
四、典型应用场景
- 开关电源与适配器的输出整流与反向保护
- LED 驱动与绿色照明系统中的高效整流单元
- 安防摄像头、电源模块中的反向保护与快速整流
- 通信设备与户外终端的稳压/保护电路
- 工业控制与电机驱动的整流与浪涌吸收电路
五、封装与热管理建议
SOD-123FL 为小型表面贴装封装，利于高密度布板。由于在 5 A 工作电流下仍会产生一定损耗，建议：
- 采用较宽短的铜地线和足够的铜厚以提升散热能力；
- 在器件下方或附近配置热过孔（Thermal vias）引导热量至内层/底层铜箔；
- 合理安排走线与器件分布，避免热聚集，并确保散热路径畅通；
- 在设计验证阶段进行热仿真与实际测温测试，确认结温不超过 150 ℃ 的安全范围。
六、选型与使用注意事项
- 若系统最高反向电压接近或超过 40 V，应选择更高 Vr 规格器件以保证裕度；
- 反向漏电流 Ir 会随温度上升而增加，在高温工况应评估对待机功耗和漏电敏感电路的影响；
- 对于高频切换或快速瞬态场景，配合合理的去耦和抑制元件以减少电磁干扰与尖峰电压；
- 在实际应用中留意焊接工艺参数与回流曲线，避免超出器件推荐的温度限制导致性能退化。
总结：K54（GOODWORK，SOD-123FL）以低正向压降、较高整流电流及良好浪涌能力，提供了一种在体积受限且需高效率整流场合的可靠解决方案。合理的热设计与电路裕度能充分发挥其性能，满足多类消费与工业应用的需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
