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GOODWORK MMBT3904T
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- GOODWORK MMBT3904T
- Type
- GOODWORK
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- GOODWORK
- Electronic Component
- MMBT3904T
- Electronic Component
- 1
- Package
- SOT-523
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.026g
- Electronic Component
- 1
- Electronic Component
- BM0230812400
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- NPN
- Frequency(f T)
- 300MHz
- Power Dissipation(Pd)
- 150mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBT3904T 产品概述
一、产品简介
MMBT3904T 是 GOODWORK（固得沃克）推出的一款小信号 NPN 晶体管，采用超小型 SOT-523 封装，面向便携式和高密度电路板的通用开关与放大应用。器件在室温及高低温环境下均具有稳定的放大性能和低漏电特性，适合要求体积小、功耗低的设计场景。
二、主要特性
- 晶体管类型：NPN（硅材质）
- 静态直流电流增益 hFE：300（测试条件 50 mA、VCE≈1 V）
- 特征频率 fT：300 MHz，适合宽带小信号放大与高速切换
- 最大集电极电流 Ic：200 mA（短时或受限负载条件）
- 集电极-射极击穿电压 VCEO：40 V
- 射基极击穿电压 VEBO：6 V
- 集电极截止电流 ICBO：50 nA（典型低漏电，利于低功耗电路）
- 集电极耗散功率 Pd：150 mW（须注意散热）
- 集射极饱和电压 VCE(sat)：约 300 mV（在 50 mA 和 5 mA 条件下测定）
- 工作结温范围：-55 ℃ 至 +150 ℃（Tj）
三、电气与性能亮点
- 高 hFE（在中等电流点）提供良好的电流放大能力，可简化前级偏置与驱动设计。
- fT 达 300 MHz，使器件在中低频射频及高速数字信号切换场合表现良好。
- 低 ICBO 与较低的 VCE(sat) 有利于降低静态功耗和开关损耗，适合电池供电与低压系统。
四、典型应用
- 小信号放大器（前置放大、差分对、射频前端的低噪声级）
- 通用开关与驱动（逻辑电平驱动、LED 驱动、继电器/小负载切换）
- 抗干扰设计中的缓冲与电平转换
- 高密度 PCB、便携式消费类电子、物联网模块、传感器前端
五、封装与热管理
- 封装：SOT-523（超小型表面贴装），适合高密度贴装与自动化贴片生产。
- 由于封装体积小且 Pd 仅 150 mW，设计时需注意 PCB 铜箔面积、过孔与散热走线，以保证结温在安全范围内；建议在实际布局中提供适当的散热铜箔并避免长期高电流工作。
- 推荐遵守器件的回流焊工艺规范，避免过热循环对可靠性的影响；装配时注意静电防护。
六、选型与使用建议
- 若电路常在 50 mA 左右工作且需要较高增益，MMBT3904T 是合适选择；若需承载长期 100–200 mA 连续电流，应评估结温与功耗限制。
- 在设计开关电路时通过基极串联限流电阻控制基极电流，以防止饱和时间过长和过热。
- 对于要求更高功率耗散或更低饱和压的场合，可考虑封装和规格更高的同类器件。
- 作为 2N3904 系列的小封装等效替代，适用于体积受限且对性能有一定要求的通用场合。
如需器件完整的电气表、封装尺寸图或典型应用电路图，可进一步提供需求，便于给出更详细的设计建议与仿真参考。
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