WMSIC Electronic Components

GOODWORK ES1J

ModelES1J
PackageSMA(DO-214AC)
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK ES1J
Type
GOODWORK
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
ES1J
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.113g
Electronic Component
1
Electronic Component
BM0230812388
Current
1A
Diode
1
Current(Ir)
1.7uA
(Vf)
1.7V@1A
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ES1J 快恢复/高效率二极管(GOODWORK 固得沃克)产品概述

一、产品简介

ES1J 是一款独立式(单个)快恢复、高效率整流二极管,由品牌 GOODWORK(固得沃克)提供,采用 SMA(DO-214AC)封装。该器件针对开关电源、逆变器及各种开关整流场合设计,在 600V 反向耐压下可稳定工作,额定整流电流 1A,具有较低的正向压降和较短的反向恢复时间,兼顾效率与开关速度。

二、主要电气参数

  • 二极管配置:独立式(单体二极管)
  • 工作结温范围:-65℃ ~ +150℃(Tj)
  • 正向压降(Vf):1.7V @ IF = 1A
  • 直流反向耐压(Vr):600V
  • 反向电流(Ir):1.7 μA(典型,测量条件通常为 Vr、25℃)
  • 反向恢复时间(Trr):35 ns(典型)
  • 整流电流:1A(额定整流电流)

以上参数为器件在标准测试条件下的典型或额定值,实际应用中应参照完整数据手册进行评估。

三、产品特点与优势

  • 快速恢复:约 35 ns 的反向恢复时间,适合中高频开关应用,能有效降低开关损耗及振铃。
  • 高耐压:600V 的反向击穿电压,为高压整流和保护电路提供足够的安全裕量。
  • 低正向压降:1A 条件下 Vf ≈ 1.7V,降低导通损耗,提高整机效率。
  • 宽温度工作范围:结温可达 +150℃,适应温度要求较高的电源与工业环境。
  • 便于电路板装配:SMA 封装适合波峰/回流焊和手工焊接,便于自动化生产。

四、典型应用场景

  • 开关电源(SMPS)的整流、输出二极管或回路保护
  • 电机驱动、逆变器的自由轮回路(freewheeling diode)
  • 电源保护电路(如反接、过压保护)
  • 高频整流与开关整流场合(中等频率范围内)
  • LED 驱动、充电设备与工业电源模块

五、封装信息与标识

  • 封装形式:SMA(DO-214AC)
  • 标识:二极管通常在封装一端有阴极标识(色带)以便区分极性;具体外观标注与尺寸请参考厂商数据手册。
  • 封装优势:SMA 在 PCB 布局中占用面积小,热阻适中,适合注重体积与成本的应用。

六、安装与热管理建议

  • 散热考虑:尽管额定整流电流为 1A,但正向压降带来的功耗(Pd ≈ Vf × IF)会使器件发热。建议在 PCB 上为二极管放置足够的铜箔面积,增加散热路径,必要时与散热片配合使用。
  • 布局建议:减小引线与走线长度,缩短高 di/dt 回路,以减少寄生电感和噪声。回流路径上加入合适的去耦和抑制元件(如 RC 抑制)以降低振铃。
  • 焊接与工艺:遵循 GOODWORK 提供的回流曲线与焊接温度限制,避免超温或长时间加热导致封装损伤或参数漂移。
  • 极性确认:焊接前确认阴极标识方向,防止反向安装造成电路损坏。

七、使用注意事项与测试建议

  • 环境因素:在高温或高湿环境下使用时,应关注反向漏电流随温度上升而增加的影响,必要时预留裕量或采取散热措施。
  • 负载冲击:在含有浪涌电流或高峰值脉冲的场合,评估二极管的瞬态承受能力,避免超过其重复峰值正向电流规格(详见数据手册)。
  • 测试验证:在产品设计阶段进行实际板级测试,包括热测试、开关时序测量、反向恢复测试与系统效率评估,确保在目标工作点下满足可靠性与性能要求。
  • 替换与等效型号:ES1J 针对 1A/600V 的快恢复应用,可与其它厂家的同类规格器件互换,但需核对 Trr、Vf、Ir 与结温等关键参数以保证系统性能一致。

如需器件完整电参数曲线、封装尺寸图、回流焊温度曲线或可靠性数据(如寿命、热阻等),建议索取 GOODWORK(固得沃克)提供的详细数据手册与参考设计资料,以便在设计与量产中获得最佳性能与稳定性。

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