Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
GOODWORK BZT52C18
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- GOODWORK BZT52C18
- Type
- GOODWORK
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- GOODWORK
- Electronic Component
- BZT52C18
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.034g
- Electronic Component
- 1
- (Zzk)
- 225Ω
- (Zzt)
- 45Ω
- Electronic Component
- BM0230640067
- Diode
- 1
- Current(Ir)
- [email protected]
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 16.8V~19.1V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C18 — 固得沃克（GOODWORK）18V 独立式稳压二极管 产品概述
一、概述
BZT52C18 是一款面向通用电子设备的独立式稳压二极管，标称稳压值 18V，实际稳压范围 16.8V～19.1V，适合作为中高压参考源或浪涌钳位元件。该器件采用 SOD-123 表面贴装封装，体积小、易于自动化贴装，适合空间受限的电路板设计。
二、主要参数
- 稳压值（标称）：18V
- 稳压值（范围）：16.8V ～ 19.1V
- 阻抗：Zzk = 225Ω；Zzt = 45Ω
- 反向电流 Ir：100nA @ 12.6V
- 最大耗散功率 Pd：500mW
- 封装：SOD-123（表面贴装）
- 品牌：GOODWORK（固得沃克）
- 配置类型：独立式稳压二极管（单颗元件实现稳压/钳位功能）
三、产品特点
- 稳压电压适中，适用于需要约 18V 稳压点的应用场景。
- 低漏电流（在 12.6V 条件下仅 100nA），适合对静态漏电敏感的电路。
- 两种阻抗参数表明在不同工作区间的动态响应：较高的 Zzk 指示在低电流或起始区的较大电压变化倾向，较低的 Zzt 表明在规定稳压电流下具有较好的电压稳定性。
- SOD-123 小型封装便于高密度电路板布局和自动化加工。
四、典型应用
- 作为 18V 轨电源的肖特基/前级钳位或过压保护元件。
- 参考电压源、检偏电路或某些非精密稳压场合的基准点。
- 通信设备、仪表和传感器接口的浪涌/尖峰抑制。
- 作为电源管理电路中低功率分流稳压元件，与限流电阻配合使用以实现简单可靠的稳压功能。
五、设计与使用建议
- 功耗管理：最大耗散功率为 500mW，应考虑 PCB 铜箔散热和环境温度对功率的降额；在长期高功耗场合建议选用更大封装或增加散热措施。
- 工作点选择：稳压二极管通常作并联式（作为齐纳基准）使用，需配合合适的限流电阻以控制通过器件的电流在推荐稳压区间内，避免在低电流区工作导致电压不稳定（对应较大的 Zzk）。
- 漏电流敏感电路：若系统对漏电流极为敏感，应注意在低电压时仍有 100nA 级别的反向电流存在，必要时选择更低漏电的型号或使用有源参考源。
- 焊接与可靠性：SOD-123 为常见贴片封装，支持回流焊工艺；在板上布局时保持足够的焊盘尺寸和热沉铜箔以利于散热和可靠焊接。
六、选型参考
若应用需要更高精度或更低温漂的参考，应考虑使用精密基准源（如带有温度补偿的基准芯片或 TL431 可调稳压器）；若功率或浪涌能力要求更高，可选用更大功率封装的稳压二极管或采用并联/级联功率分担方案。对于常规 18V 钳位与参考用途，BZT52C18 在小型化和低成本设计中具有良好性价比。
如需具体电气特性曲线、温度特性或封装尺寸图，请参考 GOODWORK 官方数据手册以获得完整的测试条件与推荐使用范围。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
