WMSIC Electronic Components

GOODWORK 5N10

Model5N10
PackageSOT-23
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK 5N10
Type
GOODWORK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
5N10
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0230099621
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.2W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
100V
Capacitor(Ciss)
206pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

5N10(GOODWORK 固得沃克)产品概述

一、产品简介

5N10 是一款单颗 N 沟增强型 MOSFET,封装为 SOT-23,适用于低功率开关和功率管理场合。该器件耐压 100V,连续漏极电流 5A(器件极限值),典型耗散功率 1.2W,工作温度范围宽(-55℃ 至 +150℃),适合便携设备、开关电源和保护电路等应用。

二、主要电气参数

  • 漏源耐压 Vdss:100V
  • 连续漏极电流 Id:5A
  • 导通电阻 RDS(on):140mΩ(Vgs=10V, Id=3A)
  • 阈值电压 Vgs(th):约 3V
  • 总栅电荷 Qg:4.3nC(Vgs=10V)
  • 输入电容 Ciss:206pF(Vds=50V)
  • 反向传输电容 Crss:1.4pF(Vds=50V)
  • 功耗 Pd:1.2W(SOT-23 封装典型)
  • 工作温度:-55℃~+150℃

三、特性亮点与应用场景

  • 高频开关兼顾导通与开关损耗:Q g 适中且 Crss 较小,有利于降低米勒效应,适合中高压快速开关。
  • 小封装、功率密度适中:SOT-23 适合空间受限的 PCB 设计,适用于电池供电设备、低功率 DC-DC 升降压转换、线性负载开关、继电器/电磁阀驱动及电源保护电路。
  • 阈值电压 ~3V,需注意门极驱动:在 5V 逻辑驱动下导通性能会受到影响,若要求较低 RDS(on) 建议采用 10V 门极驱动。

四、驱动与热管理建议

  • 驱动电压:若追求最低导通阻抗,建议 Vgs=10V;若仅用 5V 或 3.3V 驱动,应检查在该电压下的 RDS(on) 并评估损耗。
  • 开关速度优化:Qg=4.3nC,选择合适驱动电流可在兼顾开关损耗与 EMI 的前提下实现快速翻转。Crss 小,有利于减少米勒下冲。
  • 散热与布局:SOT-23 封装 Pd=1.2W(典型),实际可用功耗受 PCB 铜面积和环境温度影响,设计时应留足散热铜箔并缩短电流回路路径,必要时做散热垫或增加热 vias。高温工况建议降额使用以保证可靠性。

五、封装与注意事项

  • 封装:SOT-23,小体积,便于自动贴装。
  • 引脚示例(以厂家资料为准):常见 SOT-23 布局为 1:G,2:D,3:S;具体请参照 GOODWORK 官方封装图纸与 PCB 封装建议。
  • 使用提醒:器件为静电敏感元件(ESD),装配与测试过程需采取防静电措施;产品选型时请参考完整数据手册以获取 SOA、脉冲能力及测试条件等详细信息。

总结:5N10(GOODWORK)以 100V 耐压、适中导通电阻和小体积封装为特征,适合中高压但低至中等电流的开关和保护类应用。设计中注意门极驱动、散热与 PCB 布局,即可发挥其在空间受限电源系统中的优势。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.