WMSIC Electronic Components

GOODWORK SS84

ModelSS84
PackageSMC(DO-214AB)
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK SS84
Type
GOODWORK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
SS84
Electronic Component
1
Package
SMC(DO-214AB)
Electronic Component
Schottky Diode
Electronic Component
0.357g
Electronic Component
1
Electronic Component
BM0257623391
Current
8A
Diode
Electronic Component
Current(Ir)
100uA
(Vf)
550mV@8A
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS84 产品概述

一、产品简介

GOODWORK(固得沃克)SS84 为独立式肖特基整流二极管,封装为 SMC(DO‑214AB)。该器件在高电流场合具有很小的正向压降与快速恢复特性,可替代普通整流二极管,以降低功耗并提高系统效率,适用于开关电源、DC‑DC 转换、整流及续流保护等场景。

二、主要电气参数

  • 正向压降(Vf):约 550 mV @ If = 8 A
  • 额定整流电流:8 A(连续)
  • 直流反向耐压(Vr):40 V
  • 反向漏电流(Ir):100 μA @ 40 V
  • 非重复峰值浪涌电流(Ifsm):175 A
  • 工作结温范围:-65 ℃ ~ +150 ℃
  • 封装:SMC(DO‑214AB)

三、关键特性与优势

  • 低正向压降:550 mV@8A 有效降低导通损耗,尤其在高电流条件下提升效率并减少发热。
  • 低反向漏流:100 μA@40V 在高温或高压工况下仍能保持较低泄漏,有利于节能与静态功耗控制。
  • 强浪涌承受能力:175 A(峰值)满足启动、短时过载或脉冲负载的冲击要求。
  • 宽温区与高可靠性:结温支持高达 150 ℃,适配工业与汽车类温度环境(需按规范降额使用)。
  • SMC 封装:热阻较小,便于散热设计与自动贴装工艺。

四、典型应用场景

  • 开关电源整流与续流二极管(快速整流、降压/升压模块)
  • DC‑DC 转换器输出整流、同步整流替代件
  • 电池管理与充电系统的保护与整流
  • 汽车电子(符合 12 V/24 V 系统中对 40 V 等级的使用需求)
  • 通信电源、工业电源与电机驱动等需要高电流/低压降场合

五、散热与封装注意

  • SMC(DO‑214AB)为大体积金属化封装,有利于通过铜箔散热;建议在 PCB 布局中采用大面积散热铜箔与多孔过孔连接底层散热层。
  • 连续 8 A 工作时需进行热仿真与结‑环境温差评估,并按器件 SOA 与结温限制进行电流降额。
  • 浪涌能量集中时需关注峰值热冲击,若系统存在频繁浪涌,应选择更高 Ifsm 或外加限流保护。

六、使用与可靠性建议

  • 焊接建议遵循封装厂商的回流焊温度曲线,避免长时间高温升降;SMC 支持波峰/回流焊,但应控制热循环次数。
  • 储存与防潮:未封装前防潮包装,避免湿气引发焊接问题。
  • 在汽车或工业应用请留有安全裕量,按最高结温 150 ℃进行热管理与降额策略。
  • 建议在设计中加电流检测与过温保护,防止长期高温导致寿命下降。

七、订购信息与标识

型号示例:GOODWORK SS84 — 封装 SMC(DO‑214AB)。订购时请确认批次、测试报告与 RoHS/REACH 等合规证书以满足项目要求。若需替代品或并联、散热方案咨询,可提供进一步的电热仿真与选型支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.