WMSIC Electronic Components

GOODWORK 1N5819WS

Model1N5819WS
PackageSOD-323
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK 1N5819WS
Type
GOODWORK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
1N5819WS
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.028g
Electronic Component
1
Electronic Component
BM0229305746
Current
1A
Diode
Electronic Component
Current(Ir)
50uA@40V
(Vf)
580mV@1A
Electronic Component
65℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1N5819WS 产品概述

一、产品简介

1N5819WS 为 GOODWORK(固得沃克)出品的肖特基势垒二极管,面向低压高速整流与保护场景。器件为独立式封装,型号在小型表面贴装(SOD-323)封装下集成了肖特基结构,具有较低正向压降与快速开关特性,适合移动设备、电源管理与信号保护等应用。

二、主要电气参数

  • 正向压降 (Vf):580 mV @ 1 A(典型值,实际随温度和工况略有变化)
  • 整流电流:1 A(连续)
  • 非重复峰值浪涌电流 (Ifsm):9 A(单次脉冲)
  • 直流反向耐压 (Vr):40 V
  • 反向电流 (Ir):50 μA @ 40 V(常温条件下)
  • 工作结温范围:-65 ℃ ~ +125 ℃

这些参数表明该器件在低压、高频切换和瞬态浪涌场合具有良好性能,但在高温下反向漏电会随温度显著上升,设计时需考虑热管理与漏电容忍度。

三、封装与热特性

封装:SOD-323,体积小、适配高密度贴片PCB。
由于封装尺寸受限,热阻较大,单片在1 A 长时间工作时结温上升明显。建议在电路板设计中提供适当的散热措施(如加大铜箔、接地平面等)并在靠近热源处留出间距。对于经常承受浪涌或长时间高电流的应用,应考虑更大封装或并联方案。

四、典型应用场景

  • 开关电源次级整流与输出续流
  • 电源反向防护与电源路径 OR-ing
  • 快速恢复整流与高频整流场合
  • 便携式设备、移动电源、充电器与汽车电子(低压子系统)
  • 保护电路中的钳位与旁路二极管

五、PCB布局与焊接建议

  • 建议采用标准 SOD-323 焊盘尺寸并参考厂商推荐脚位图,确保焊点可靠性。
  • 为降低结温,应在焊盘下方与周围开大型铜箔并连接到散热层或地平面。
  • 使用回流焊工艺,遵循焊接温度曲线和防潮要求;如果元件属于高湿敏等级,需抽湿或回流前预烘。
  • 装配时注意极性标识,肖特基器件对反接敏感。

六、可靠性与品质说明

GOODWORK 品牌提供的 1N5819WS 在常规环境下具有稳定的电气特性,适合量产应用。需要注意肖特基二极管相较于整流二极管在高温下反向漏电增长更快,长期在高温高电压工作时需做热漂移与漏电容容差验证。对于关键应用,建议做温度加速寿命测试与浪涌试验验证。

七、选型要点与替代型号

在选型时关注:最大连续电流、峰值浪涌能力、封装散热能力与反向漏电对系统的影响。若需要更高电流或更低结温,可考虑更大封装或同参数的 SMA/SMB 系列(例如 SS14 等)作为替代;若工作电压需求低于 40 V,可以选取更低压降或更小漏电的肖特基型号。购买时确认供应商资料、批次与完整的器件数据手册以保证一致性。

如需针对具体电路进行热仿真、PCB 布局建议或替代器件对比表,我可以根据电路条件给出更精细的方案。

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