WMSIC Electronic Components

GOODWORK DSS110

ModelDSS110
PackageSOD-123FL
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK DSS110
Type
GOODWORK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
DSS110
Electronic Component
1
Package
SOD-123FL
Electronic Component
Schottky Diode
Electronic Component
0.041g
Electronic Component
1
Electronic Component
BM0257623404
Current
1A
Diode
1
Current(Ir)
200uA@100V
(Vf)
850mV@1A
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DSS110 产品概述

DSS110 是 GOODWORK(固得沃克)推出的一款小型表面贴装整流二极管,采用 SOD-123FL 封装,针对1A级整流与保护场景进行了优化。器件具有较低的正向压降、较高的反向耐压和良好的冲击承受能力,适用于消费电子电源、开关电源边缘保护、二次整流及一般整流应用。

一、产品亮点

  • 低正向压降:在1.0A 条件下正向压降仅为 850mV,有利于降低导通损耗与发热。
  • 高反向耐压:直流反向耐压(Vr)达到 100V,适应中低压电源与工业控制领域。
  • 可靠的浪涌能力:非重复峰值浪涌电流(Ifsm)30A,能抑制瞬态冲击(短时浪涌或上电冲击)。
  • 小巧封装:SOD-123FL 封装占板面积小,利于高密度设计与自动化贴装。

二、主要电气参数(基准条件)

  • 正向压降 (Vf):850mV @ 1.0A
  • 直流反向耐压 (Vr):100V
  • 连续整流电流:1A
  • 反向电流 (Ir):200μA @ 100V
  • 非重复峰值浪涌电流 (Ifsm):30A
  • 工作结温范围:-65℃ ~ +150℃

以上参数为典型器件规范,用于选型与热设计时请参考具体产品数据表的典型曲线与限制条件。

三、封装与热性能

  • 封装:SOD-123FL(小型塑封表面贴装封装),适合自动贴片与回流焊工艺。
  • 热管理:尽管器件额定连续整流电流为 1A,但工作时应注意 PCB 的散热布局(加大铜箔、靠近散热平面或使用热铜通孔)。在高环境温度或长时间高电流情况下,需对结温进行评估以确保在工作结温范围内运行。

四、典型应用场景

  • 开关电源的整流与二次侧保护
  • 消费类电子设备电源轨整流(如充电器、适配器)
  • 输出滤波举证整流、稳压电路中的整流与夹位保护
  • 极性保护/反接保护、瞬态吸收与浪涌抑制(配合合适吸收元件)
  • 工业控制与测试设备的中低压整流场景

五、设计与使用建议

  • 若长期在接近 1A 的工况下工作,应在 PCB 设计时增加散热铜箔并尽量缩短走线,降低温升。
  • 对于高脉冲或连续高浪涌环境,应评估 Ifsm 与实际浪涌频次,如有必要选用更高浪涌能力的器件或并联/外加抑制器件。
  • 反向电流在 100V 时为 200μA,若电路对漏电流敏感(如电池或高阻检测回路),需据此评估功耗与影响。
  • 回流焊时参照 SOD-123FL 的通用焊接工艺,避免超温时间过长导致封装或焊盘受损;贴片后尽快完成回流焊流程,避免潮湿导致焊接缺陷。

六、可靠性与存储

  • 器件工作结温范围宽(-65℃ 至 +150℃),适合多种极端温度工作环境。
  • 存储与搬运时遵循常规电子元器件防潮、防静电规范;如为防潮包装(MSL)器件,按制造商建议进行回流前干燥处理。
  • 在实际使用中请遵守 GOODWORK 提供的完整数据表与可靠性等级说明,以获得最长的使用寿命与最佳性能。

七、选型提醒

在最终选型时,除了关注正向压降与最大电流外,还应对以下项进行确认:实际工作电压、脉冲或浪涌能量、允许的反向漏电流、所需的封装高度以及与系统的热设计匹配。若电路对开关速度或反向恢复特性有严格要求,请向 GOODWORK 索取完整数据表中有关恢复时间和典型特性曲线的数据以便比对。

如需器件数据表、封装尺寸图或样片评估建议,可联系 GOODWORK 官方渠道获取更详尽资料与技术支持。

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