WMSIC Electronic Components

GOODWORK SS1045

ModelSS1045
PackageSMC(DO-214AB)
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK SS1045
Type
GOODWORK
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
SS1045
Electronic Component
1
Package
SMC(DO-214AB)
Electronic Component
Schottky Diode
Electronic Component
0.356g
Electronic Component
1
Electronic Component
BM0227665514
Current
10A
Diode
Electronic Component
Current(Ir)
100nA
(Vf)
550mV@10A
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
45V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS1045 产品概述 — GOODWORK(固得沃克)肖特基二极管

一、产品简介

GOODWORK(固得沃克)SS1045 为独立式肖特基整流二极管,封装为 SMC(DO-214AB),面向中高功率整流与开关应用。该器件在10A电流下正向压降典型值为 0.55V(550mV),直流反向耐压 45V,45V 条件下反向漏电流典型值仅 100nA,适合需要低压降、低漏电与高整流电流的电源设计场景。

二、主要电气参数

  • 正向压降(Vf):0.55V @ IF = 10A
  • 额定整流电流:10A(DC)
  • 直流反向耐压(Vr):45V
  • 反向电流(Ir):≈100nA @ Vr = 45V(典型值)
  • 配置形式:独立二极管(单芯封装)
  • 封装:SMC(DO-214AB)

三、关键性能亮点

  • 低正向压降:在大电流条件下仍保持约0.55V的低压降,有助于降低整流损耗与发热,提升效率。
  • 低反向漏电:45V 时漏电仅约100nA,适合要求低待机损耗或高阻隔性的应用。
  • 高整流能力:10A 的连续整流电流适用于中功率开关电源、电机驱动及整流桥等场景。
  • 快速恢复:肖特基结构天然具有快速恢复与低储能特性,利于开关频率较高的电源设计。

四、封装与热管理

SMC(DO-214AB)封装具有较好的散热面积与机械强度,但在高电流工作时仍需良好PCB散热设计:

  • 建议在焊盘下方及周围增加铜镀层和过孔形成散热通道;
  • 在10A连续工况下考虑加散热板或铜柱导热,避免结温超限;
  • 焊接时注意回流曲线以保证焊点可靠性。

五、典型应用场景

  • 开关电源(输出整流)
  • 电池充放电与保护电路(反向保护)
  • DC-DC 转换器与电机驱动整流
  • 逆变器、功率模块的自由轮回二极管
  • 各类中高电流整流场合

六、设计与使用建议

  • 温度依赖:反向漏电与正向压降会随结温上升而变化,设计时需考虑温漂与额定余量;
  • 并联使用:若需增加电流能力,应注意匹配正向特性并采用合理的电流均流措施(小阻抗串联或单元匹配);
  • 反向峰值电压与浪涌:考虑到瞬态电压与浪涌电流,必要时加装浪涌限流或保护元件;
  • 焊接工艺:遵循厂家回流温度曲线,避免过热损伤封装与焊点。

七、选型注意与替代

在选择时确认待机漏电、工作电流与最高反向电压是否满足系统需求。若系统电压超过45V或需要更低正向压降,可考虑耐压更高或更低Vf的肖特基型号;若关注更小封装或更高电流,则选择不同封装(如TO-220 / DPAK)或并联多个器件。

总结:GOODWORK SS1045 在中高电流、低压降与低漏电场合表现优异,适合对效率与待机损耗有较高要求的电源与整流应用。合理的PCB散热与热设计是发挥其性能与可靠性的关键。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.