WMSIC Electronic Components

GOODWORK SS16

ModelSS16
PackageSMA(DO-214AC)
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK SS16
Type
GOODWORK
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
SS16
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
Schottky Diode
Electronic Component
0.092g
Electronic Component
1
Electronic Component
BM0257623390
Current
1A
Diode
Electronic Component
Current(Ir)
200uA
(Vf)
700mV@1A
Electronic Component
Electronic Component
Electronic Component
2000
Voltage Rating(Vr)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS16 产品概述

一、概述

SS16 是一款肖特基势垒二极管,由 GOODWORK(固得沃克)生产,封装为 SMA(DO-214AC)。该器件为独立式肖特基整流二极管,额定整流电流为 1A,反向耐压 60V,典型正向压降为 700mV(在 1A 时),在最大反向电压 60V 时的反向漏电流为 200µA。凭借肖特基二极管固有的低正向压降和快速开关特性,适合需要高效整流与快速响应的电源和保护场合。

二、关键参数

  • 器件类型:肖特基二极管(Schottky)
  • 品牌:GOODWORK(固得沃克)
  • 封装:SMA(DO-214AC)
  • 正向压降:Vf = 700mV @ If = 1A
  • 直流反向耐压:Vr = 60V
  • 连续整流电流:If = 1A
  • 反向漏电流:Ir = 200µA @ Vr = 60V

三、主要特性与优势

  • 低正向压降:在大电流条件下 Vf 约 0.7V,降低整流损耗,提高系统效率。
  • 快速恢复与低结电容:肖特基结构使开关损耗小,适合开关电源及高速脉冲电路。
  • 紧凑封装:SMA 表面贴装体积小,适合自动化贴片生产与空间受限的电路板设计。
  • 工作可靠:适用于一般功率整流、逆接保护与电源 OR-ing 等场景(实际可靠性与环境条件请参照完整技术资料)。

四、典型应用场景

  • 开关电源输出整流与续流二极管
  • DC-DC 转换器整流与同步整流替代
  • 电池管理系统的 OR-ing / 防反接电路
  • 逆变器及太阳能、汽车电子中需要低 Vf 的整流场合
  • 高频脉冲或快恢复需求的保护电路

五、功耗与散热考量

在最大整流电流 1A 时,单管功耗近似为 P = Vf × If = 0.7V × 1A = 0.7W。由于 SMA 封装的散热能力有限,实际使用时需注意:

  • 在高电流或高环境温度下对器件进行散热评估与 PCB 铜箔加厚。
  • 必要时采用并联多只器件或降低工作电流以减小结温上升。
  • 关注反向漏电随温度的显著增加;在高温工作环境中应检查 Ir 的温漂影响。

六、封装与安装注意

  • SMA(DO-214AC)为常见表贴封装,适合回流焊流程。建议按照制造商焊接指南选择合适的回流曲线和预热参数,避免过冲升温损伤器件。
  • 贴片时保证焊盘设计有良好散热路径及适当的焊膏量,减少虚焊或热阻过大。
  • 存储与搬运避免潮气与机械冲击,必要时按防潮等级处理并在推荐时间内回流焊接。

七、选型与采购建议

  • 若设计对正向压降或漏电流有更严苛要求,可比较同类型号(如不同 Vf 或更低 Ir 的肖特基器件)并参考完整数据手册的温度特性曲线。
  • 采购时确认 GOODWORK(固得沃克)官方型号、包装与批次信息,必要时索取检验报告与大电流测试数据。
  • 量产前建议进行实际电路板上的热仿真与实测,包括不同工况下的结温与漏电评估,以保证长期可靠性。

如需完整电气特性曲线、封装尺寸图或回流焊规范,请提供联系方式或索要 GOODWORK 官方数据手册,我可以协助整理关键技术资料。

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