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GOODWORK AO3400A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- GOODWORK AO3400A
- Type
- GOODWORK
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- GOODWORK
- Electronic Component
- AO3400A
- Electronic Component
- 1
- Package
- SOT-23-3L
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0257623409
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 1.5W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AO3400A 产品概述
一、规格摘要
AO3400A（GOODWORK 固得沃克）为一只小型 N 沟道增强型场效应晶体管，主要参数如下：漏源电压 Vdss = 30V，连续漏极电流 Id = 5.8A，导通电阻 RDS(on) = 52mΩ @ Vgs = 2.5V，耗散功率 Pd = 1.5W，阈值电压 Vgs(th) = 1.4V @ 250µA，输入电容 Ciss = 1.05nF，反向传输电容 Crss = 77pF @ 15V，工作结温范围 -55℃ ~ +150℃，封装为 SOT-23-3L，单只装量：1。
二、主要特性
- 低电阻导通：在逻辑电平驱动（Vgs = 2.5V）下 RDS(on) = 52mΩ，适合低压、较大电流的开关或线性应用。
- 低门极电容：Ciss = 1.05nF 与 Crss = 77pF 意味着在中低频率开关时具有较小的开关损耗和较快的开关响应。
- 宽工作温度与可靠性：-55℃ 至 +150℃ 的结温允许在较苛刻环境中工作（需注意功耗与散热）。
三、封装与热管理
SOT-23-3L 封装体积小、适合表面贴装，但热阻较大，额定耗散功率 Pd = 1.5W 为典型静态条件下的数值。实际印制电路板（PCB）布局应通过增加铜箔面积、加大散热焊盘或多层过孔来改善散热性能，避免长期在高结温下工作以延长器件寿命。
四、典型应用场景
- 便携式设备的低压电源开关与功率路由。
- DC-DC 转换器的开关管或同步整流（视频率与效率需求）。
- 电池管理与电源反向保护。
- 小电流马达驱动、继电器驱动和通用负载开关。
五、设计与使用建议
- 驱动电压：器件在 2.5V 门压下已表现出较低 RDS(on)，适合直接被 MCU 或逻辑电平驱动，但建议留有门阈裕量，确保在不同温度与条件下仍能充分导通。
- 开关损耗考虑：Ciss 与 Crss 会在高开关频率下带来显著开关损耗，若用于高频应用需评估总能量损耗并考虑门极驱动器或增加门阻以控制电流振铃。
- 热设计：按 I^2·R 计算导通损耗，并结合 PCB 散热能力计算结温，必要时采用更大封装或并联器件以分散热量。
- 感性负载保护：驱动电感性负载时，应在电路中加入合适的续流或吸收元件以抑制峰值电压与降低 Crss 导致的电压反冲。
六、选型与替代建议
若应用要求更低的导通电阻或更高的耗散功率，可优先考虑更大封装（如 SOT-223、SO-8）或近似规格但 RDS(on) 更低的型号。若需更高电压裕量或更低门阈，请在选型时对比 Vdss、Vgs(max) 与热阻等参数。
七、总结
AO3400A（GOODWORK）以小体积、逻辑级门压下的低 RDS(on) 和适中的开关特性，适合移动设备、功率路由及一般开关场合。设计时要重视 PCB 散热、关断/导通损耗及感性负载保护，确保在额定条件下可靠运行。
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