WMSIC Electronic Components

GOODWORK BZT52C6V2

ModelBZT52C6V2
PackageSOD-123
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK BZT52C6V2
Type
GOODWORK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
BZT52C6V2
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.034g
Electronic Component
1
(Zzk)
150Ω
(Zzt)
10Ω
Electronic Component
BM0257623394
Diode
1
Current(Ir)
3uA@4V
Power Dissipation(Pd)
500mW
Electronic Component
5.8V~6.6V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C6V2 — GOODWORK 固得沃克 6.2V 独立式稳压二极管(SOD-123)

一、产品概述

BZT52C6V2 是 GOODWORK(固得沃克)推出的一款独立式低功耗稳压二极管,标称稳压值 6.2V,典型稳压范围 5.8V~6.6V,封装为表贴型 SOD-123。该器件适用于小电流基准与低功耗稳压场合,体积小、成本低、便于自动化贴装。

二、主要电气参数

  • 标称稳压值:6.2V(范围 5.8V~6.6V)
  • 反向电流 Ir:3 μA @ 4.0V(漏电流指标)
  • 耗散功率 Pd:500 mW(最大耗散)
  • 动态阻抗 Zzt:10 Ω(稳压电流工作点下小信号阻抗)
  • 低电流区阻抗 Zzk:150 Ω(接近击穿起始区的阻抗特性)
  • 封装:SOD-123(表面贴装)
  • 封装品牌:GOODWORK(固得沃克)

三、典型应用场景

  • 小电流稳压与基准电源(传感器、低速 MCU 外围)
  • 电平钳位、浪涌/尖峰抑制
  • 信号线路保护与参考电压源
  • 便携电池设备、通讯终端的低功耗电压稳压

四、使用建议与计算示例

  • 最大允许电流(近似):Imax ≈ Pd / Vz = 0.5W / 6.2V ≈ 80 mA(短时),长期工作建议远低于此值以保证可靠性。推荐稳态工作电流一般设在 1–20 mA 区间。
  • 串联限流电阻计算示例:若供电 12V,希望稳流 Iz = 5 mA,R = (Vs − Vz) / Iz = (12 − 6.2) / 5 mA ≈ 1.16 kΩ,限流电阻功耗 Pr ≈ (Vs − Vz) × Iz ≈ 5.8V × 5 mA ≈ 29 mW。
  • 对于瞬态电流和浪涌,注意不要超过封装散热能力;必要时串联限流或并联大功率抑制元件。

五、封装与可靠性

SOD-123 小型表贴封装,适合自动贴装及回流焊工艺。由于封装体积小,热阻较大,耗散能力受环境温度限制,设计时应考虑功率与环境温度的降额。保存与焊接应遵循湿敏等级与回流温度曲线,避免长时间高温和潮湿环境。

六、选型要点与注意事项

  • 若需更稳定的参考电压或更低噪声,应选择低 Zzt 的型号或使用专用稳压芯片。
  • 注意 Ir 指标(3 μ[email protected])在高阻电路中可能影响精度,应考虑漏电流对电路的影响。
  • 长期可靠性考量请留足安全裕度(电流与功耗降额),并在 PCB 布局中为热量散布和散热做好安排。

本产品适用于对成本、体积有要求的低功耗稳压与保护场景,选型与电路设计时请以实际应用电流、环境温度和热管理为依据。若需完整数据手册(包括温度特性、测试电流点、绝对最大额定值等),建议联系 GOODWORK 或查看其正式 Datasheet。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.