WMSIC Electronic Components

GOODWORK K26

ModelK26
PackageSOD-123FL
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK K26
Type
GOODWORK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
K26
Electronic Component
1
Package
SOD-123FL
Electronic Component
Schottky Diode
Electronic Component
0.038g
Electronic Component
1
Electronic Component
BM0263571072
Current
2A
Diode
Electronic Component
Current(Ir)
100uA
(Vf)
700mV@2A
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

K26 产品概述

一、产品简介

K26 为 GOODWORK(固得沃克)出品的独立式肖特基二极管,采用 SOD-123FL 小封装,专为高效率整流与保护应用设计。器件以低正向压降和快速响应为主要卖点,适合体积受限且需高开关频率的电源和保护电路。

二、主要参数

  • 正向压降:典型 ~0.55V @ 2A,最大可达 0.70V @ 2A(随温度和批次略有差异)
  • 直流反向耐压(Vr):60V
  • 额定整流电流:2A(连续)
  • 反向电流(Ir):典型 100μA(在 Vr 条件下,随温度显著上升)
  • 非重复峰值浪涌电流(Ifsm):50A(单次脉冲)
  • 工作结温范围:-65℃ 至 +150℃
  • 配置:独立式(单个二极管)

三、封装与引脚

SOD-123FL 为扁平塑料封装,底部有焊盘,适用于表面贴装(SMT)。引脚定义简单:一端为阴极,一端为阳极。封装体积小,便于在高密度电路板上布局,但需注意焊盘设计与散热。

四、主要特性与优势

  • 低正向压降:较低的导通损耗,有助于提高整流效率并降低发热。
  • 快速恢复特性:肖特基结构天然无显著恢复延时,适合开关电源与高速整流。
  • 高浪涌能力:50A 的非重复峰值浪涌电流能承受启动或短时浪涌。
  • 宽工作温度:耐高低温,适用于工业类环境。

五、典型应用场景

  • 开关电源整流与回流二极管
  • 电池充放电保护与反向保护电路
  • 低压降逆变、稳压模块与电源管理单元
  • 车载电子、消费类电子与工业控制的小电流整流

六、设计与使用要点

  • 连续 2A 的工作电流需配合良好 PCB 散热,短且宽的铜箔走线可降低结温。
  • 反向漏电随温度上升显著增加,高温场合需评估功耗与漏电容忍度。
  • Ifsm 为非重复峰值,重复或长时间浪涌会损坏器件,应在电路设计中避免。
  • 焊接工艺按 SOD-123FL 推荐曲线执行,避免过高回流峰值以保证可靠性。

七、可靠性与环境适应性

器件耐热性能良好,工作结温上限 150℃。在潮湿或振动环境下建议作可靠性验证。长期工作时应留有热裕量并考虑电流与环境温度对寿命的影响。

八、采购与替代建议

GOODWORK K26 适用于对成本和性能都有要求的整流场合。如需更低漏电或更高电压等级,可考虑同系列或其他厂商的肖特基替代型号;选型时注意正向压降曲线、漏电随温度特性及封装热性能的匹配。

如需器件详细数据表(对温度下的 Ir 曲线、Vf 曲线、封装尺寸与推荐焊盘),可进一步提供以便深入评估和布局设计建议。

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