WMSIC Electronic Components

GOODWORK MBRD30100

ModelMBRD30100
PackageTO-252
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK MBRD30100
Type
GOODWORK
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
MBRD30100
Electronic Component
1
Package
TO-252
Electronic Component
Schottky Diode
Electronic Component
0.452g
Electronic Component
1
Electronic Component
BM0230812398
Current
30A
Diode
1
Current(Ir)
20uA
(Vf)
850mV@30A
Electronic Component
Electronic Component
Electronic Component
2500
Voltage Rating(Vr)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MBRD30100 产品概述

一、产品简介

MBRD30100 为 GOODWORK(固得沃克)系列高电流肖特基二极管,采用一对共阴极(1对共阴极)设计,单片内含两颗肖特基二极管,阴极引脚共用,便于在桥式整流、双路输出等电路中直接采用。器件额定整流电流为 30A,直流反向耐压(Vr)为 100V,封装为 TO-252(DPAK),适合表面贴装和良好散热要求的电源应用。

二、主要电气参数

  • 配置:1对共阴极(Common Cathode)
  • 额定整流电流:30A(连续整流)
  • 正向压降:Vf ≈ 850 mV @ IF = 30A(典型测试点)
  • 直流反向耐压:Vr = 100V
  • 反向电流:Ir ≈ 20 µA(常温、接近额定反向电压时典型值)
  • 封装:TO-252(DPAK),适用于贴片工艺与散热设计

三、产品特性与优势

  • 低正向压降:在高电流工况下保持较低的 Vf,减少整流损耗和发热。
  • 高整流电流能力:30A 连续整流,满足中大功率电源输出、整流等需求。
  • 可靠的高压耐受性:100V 反向耐压适用于中高压电源与逆变链路。
  • 共阴极封装:便于实现双向输出、半桥整流及电源二次侧整流设计,减少焊盘与布线复杂度。
  • TO-252 封装:结构坚固、便于 PCB 散热设计,可通过大铜箔与热垫提高散热能力。

四、典型应用场景

  • 开关电源(SMPS)输出整流与同步整流辅助器件
  • 车载电子、LED 驱动电源与工业电源整流器
  • 直流母线保护、旁路整流及逆变器二次侧整流
  • 大电流整流模块与电池充放电路径

五、封装与热管理建议

TO-252(DPAK)封装要求合理的 PCB 散热设计以保证长期可靠性。建议:

  • 在 PCB 底层与顶层提供大面积铜箔热垫并通过过孔引至内层散热层;
  • 在 30A 工作点考虑采用外部散热器或加厚铜箔以降低结温;
  • 布局时保持输入、输出回路短而粗,减小寄生电感与压降。

六、使用注意与可靠性

  • 请根据实际工作电流与环境温度评估结温(Tj),避免长期在极限额定值下工作以延长寿命;
  • 并联使用时需注意电流均流问题,建议增加阻抗匹配或选用电流均衡措施;
  • 反向漏电流随温度上升显著增加,高温环境需评估漏电对系统的影响。

七、采购与型号说明

型号:MBRD30100
品牌:GOODWORK(固得沃克)
封装:TO-252(DPAK)
在选型时请参考厂家完整数据手册以获取温度依赖曲线、浪涌能力、极限参数与封装尺寸图,便于在电路设计与 PCB 布局中正确应用。若需匹配其它参数(如更低 Vf、更高 Vr 或不同封装),可咨询供应商或技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.