Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
GOODWORK SS12
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- GOODWORK SS12
- Type
- GOODWORK
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- GOODWORK
- Electronic Component
- SS12
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.099g
- Electronic Component
- 1
- Electronic Component
- BM0264757977
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 200uA
- (Vf)
- 550mV@1A
- Electronic Component
- 65℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS12 肖特基二极管（GOODWORK）产品概述
一、产品简介
SS12 为 GOODWORK（固得沃克）出品的独立式肖特基整流二极管，封装为 SMA（DO-214AC）。器件面向中低压、大电流脉动场合，具有低正向压降和快速开关特性，适用于电源整流、反向保护与续流等用途。
二、主要规格
- 二极管配置：独立式
- 正向压降：Vf = 550 mV @ If = 1 A
- 直流反向耐压：Vr = 20 V
- 最大整流电流：If(AV) = 1 A
- 反向电流：Ir = 200 μA @ Vr = 20 V（常温）
- 非重复峰值浪涌电流：Ifsm = 30 A
- 工作结温范围：-65 ℃ ~ +125 ℃
- 封装：SMA (DO-214AC)
三、关键特性与优势
- 低正向压降（0.55 V@1 A）：降低整流损耗，提高效率，尤其在低压供电系统中能显著降低发热。
- 低反向泄漏（200 μA@20 V）：在断态下保持较小漏电，适合电池供电或待机电路。
- 高浪涌能力（30 A）：可承受短时大电流冲击，适合启动浪涌或突发负载场景。
- 耐温范围广：适合工业级环境。
四、典型应用
- 开关电源与降压整流
- 反向电池保护与防反接电路
- 电池充放电路径、备份电源切换
- 电机驱动、继电器线圈续流二极管
- 汽车电子（非高压）、消费电子电源管理
五、热管理与可靠性
在1 A 工作电流下器件功耗约为 P ≈ If·Vf ≈ 0.55 W，散热依赖于 PCB 铜箔面积及布局。建议在实际应用中为器件提供充足的散热铜箔，并对工作电流进行热降额（Ambient 温度升高时适当降低额定电流）。长期可靠性受结温与反向应力影响，避免在高 Vr 与高温下长期工作以控制泄漏增长。
六、PCB与焊接建议
- 封装 SMA 适合自动贴装，留足焊盘和热沉铜面积以降低结温。
- 推荐遵循制造商的焊盘布局与回流曲线，避免长时间超温。
- 对于波峰/回流焊，按通用无铅工艺控制峰值温度和时间。
七、选型与使用注意
- 若系统电压接近或超过20 V，应选更高 Vr 的型号；
- 在高温环境下，反向漏电会显著上升，需评估待机消耗；
- 若需更低 Vf 或更高电流能力，可考虑更大封装或并联，但并联需考虑电流共享。
- 采购时确认包装方式（散装/卷带）与出货标识（SS12 / GOODWORK）。
该器件以其低损耗、良好抗浪涌性能及工业级温度范围，适合对效率与可靠性有要求的中低压电源方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
