Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
GOODWORK US2J
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- GOODWORK US2J
- Type
- GOODWORK
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- GOODWORK
- Electronic Component
- US2J
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.093g
- Electronic Component
- 1
- Electronic Component
- BM0264730019
- Current
- 2A
- Diode
- 1
- Current(Ir)
- 5uA@600V
- (Vf)
- 1.85V@2A
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
US2J 二极管（GOODWORK 固得沃克）产品概述
一、产品简介
US2J 为 GOODWORK（固得沃克）出品的高速整流二极管，额定反向耐压600V、整流电流2A，采用SMA（DO-214AC）封装。该器件结合低正向压降与短反向恢复时间，适合开关电源、高频整流与低损耗整流场合，兼顾可靠性与体积优势。
二、主要参数
- 正向压降（Vf）：1.85V @ 2A
- 直流反向耐压（Vr）：600V
- 整流电流：2A（平均整流）
- 反向电流（Ir）：5μA @ 600V
- 反向恢复时间（Trr）：70ns
- 工作结温范围：-65℃ ~ +150℃
- 非重复峰值浪涌电流（Ifsm）：80A
- 封装：SMA (DO-214AC)
三、关键特性
US2J 的正向压降在中等电流下保持较低水平，有助于降低导通损耗；70ns 的反向恢复时间使其在开关频率较高的场合仍能保持较低的开关损耗与电磁干扰。600V 的耐压等级和较小的反向漏电流（5μA）保证了在高压侧的可靠工作。宽工作温度范围和80A 的瞬态浪涌能力提升了抗冲击与过载能力。
四、典型应用
- 开关电源（SMPS）输出整流或续流二极管
- 高频整流电路与逆变器低损耗整流
- 电子变压器、LED 驱动电源
- 开关器件的续流、钳位与防反向保护
五、封装与热管理
SMA 封装体积小、适合表面贴装工艺，但热阻相比较大电流封装仍有限。设计中应：
- 在 PCB 上提供合适的铜箔散热区与过孔以降低结温；
- 考虑器件靠近散热路径布局，避免热源近距堆叠；
- 对于长期接近额定电流的工况，留出余量并进行热仿真验证。
六、选型与使用建议
- 若工作频率或电流更高，需评估反向恢复引起的峰值电流与 EMI，并视情况增加缓冲电路或选用超快恢复/肖特基器件；
- 避免在高温下长期满载运行，以延长器件寿命；
- 并联使用时需注意电流分享问题，推荐采取匹配或单元保护措施；
- 在浪涌或雷击可能的应用中，评估Ifsm 与系统保护元件（熔断器、TVS）的协同。
US2J 凭借600V 的高耐压与70ns 的快速恢复特性，适合需要兼顾高压等级与高速整流的电源设计场合，为体积受限但性能要求较高的应用提供性价比较优的解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
