WMSIC Electronic Components

GOODWORK SS810-SMC SS810

ModelSS810-SMC
PackageSMC(DO-214AB)
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK SS810-SMC
Type
GOODWORK
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
SS810-SMC
Electronic Component
1
Package
SMC(DO-214AB)
Electronic Component
Schottky Diode
Electronic Component
0.348g
Electronic Component
1
Electronic Component
BM0264730017
Current
8A
Diode
Electronic Component
Current(Ir)
20uA
(Vf)
850mV@8A
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS810-SMC 产品概述

一、产品简介

SS810-SMC 为 GOODWORK(固得沃克)出品的独立式肖特基整流二极管,采用 SMC(DO-214AB)封装,针对中高电流功率整流与保护场合设计。该器件具有较低的正向压降和良好的浪涌容量,适用于要求效率与可靠性兼顾的电源与功率应用。

二、主要参数

  • 型号:SS810-SMC
  • 封装:SMC (DO-214AB),独立式(离散器件)
  • 正向压降:Vf = 850 mV @ IF = 8 A
  • 直流整流电流:IF(AV) = 8 A
  • 直流反向耐压:VR = 100 V
  • 反向漏流:IR ≈ 20 μA(典型/额定条件)
  • 非重复峰值浪涌电流:IFSM = 175 A(一次性浪涌)
  • 工作结温范围:-65 ℃ ~ +150 ℃

三、主要特性

  • 低正向压降:在高电流条件下 Vf≈0.85 V,有助于降低导通功耗,提高整机效率。
  • 肖特基特性:载流以多数载流子为主,开关速度快、反向恢复小,适合开关电源和快速整流场合。
  • 良好浪涌能力:非重复峰值浪涌 175 A,可应对启动或短时过载冲击。
  • 宽工作温度:-65 ℃ 至 +150 ℃ 的结温范围,适应恶劣环境与工业级应用。

四、典型应用

  • 开关电源(AC/DC、DC/DC)整流与输出保护
  • 电池充放电路径与反接保护
  • 功率模块的自由轮回二极管与续流保护
  • 逆变器、UPS、电机驱动等需高浪涌承受能力的场景
  • 太阳能逆变器及分布式电源系统

五、封装与热管理建议

SMC(DO-214AB)为表面贴装大功率封装,适合 PCB 直接焊接。为了保证长期可靠性与稳定热性能,建议:

  • 在 PCB 布局中预留充足的铜箔散热区,并考虑多层过孔散热通道;
  • 在高平均电流工作下进行功耗计算并适当降额;
  • 注意反向漏流随温度上升而增加,设计时考虑高温工况下的漏电影响。

六、选型与使用要点

  • 若系统关注最高效率,应在目标工作电流点查看实际 Vf,确认损耗;
  • 在存在反向高电压脉冲或长期高温的环境,可评估反向漏流对系统的影响并考虑必要的防护;
  • 对浪涌能力有严格要求的应用,需结合系统实际浪涌波形与频率确认是否合适;
  • 推荐参考 GOODWORK 的数据手册与封装图进行 PCB 尺寸与焊接工艺设计。

总结:SS810-SMC 提供了 100 V 耐压与 8 A 持续整流能力,配合低 Vf 与较高浪涌承受力,适合多种中高功率整流与保护应用。选型时关注散热设计与高温下的漏电表现,可获得较好的性能与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.