WMSIC Electronic Components

Gigadevice GD32F303VET6

ModelGD32F303VET6
PackageLQFP-100(14x14)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32F303VET6
Type
GIGADEVICE
Minimum package
540 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD32F303VET6
Electronic Component
1
Package
LQFP-100(14x14)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
2.033g
CPU
ARM Cortex-M4
I / O
80
Electronic Component
1
ADC
12bit
DAC
12bit
Electronic Component
BM0095860415
Operating Voltage
2.6V~3.6V
CPU
120MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32F303VET6 产品概述

概述

GD32F303VET6 是北京兆易创新(Gigadevice)推出的一款高性能单片机(Microcontroller Unit,MCU),基于ARM Cortex-M4内核,集成了64KB的SRAM和256KB的闪存,采用LQFP-100(14x14mm)的封装,适合多种嵌入式应用,特别是在工业自动化、消费电子及智能家居等领域。

核心特性

  1. 内核架构: GD32F303VET6基于ARM Cortex-M4内核,主频可达108MHz,具有强大的处理能力和灵活的指令集。Cortex-M4内核支持浮点运算,这在某些数值计算密集的应用中显著提升其性能。

  2. 存储器配置: 该芯片集成64KB SRAM和256KB闪存,适合存储复杂的算法和数据结构。256KB的闪存可满足中小规模应用的存储需求,同时64KB的SRAM提供了足够的运行空间,确保程序的高效执行。

  3. 丰富的外设接口: GD32F303VET6设计了多达51个外部中断,支持多种通信接口,包括USART, SPI, I2C和CAN等,同时还具有ADC(模拟-数字转换器)和PWM(脉宽调制)等功能。这些丰富的外设连接能力使得该单片机能够灵活地满足各类传感器和执行器的连接需求。

  4. 低功耗特性: 本产品设计注重节能效率,具有多种节能模式,适合于需要长时间稳定运行的电池供电设备。同时,超低功耗特性有助于延长产品的使用寿命,尤其在智能家居设备等场景中尤为重要。

  5. 开发支持: GD32F303VET6得益于Gigadevice的强大开发支持,提供相应的开发工具和软件库,如HAL库和STM32移植层,使得开发者能够更快速地上手并进行产品设计。此外,社区支持和技术文档也极大地便利了新用户的学习和开发过程。

应用场景

GD32F303VET6单片机广泛应用于以下领域:

  • 工业控制: 在自动化设备中,用于数据采集、传感器接口与执行器控制,GD32F303VET6的高性能和多通道ADC使其成为理想选择。

  • 消费电子: 包括智能家居产品(如智能灯泡、家用电器控制)、可穿戴设备等,利用其低功耗和强大的处理能力,实现更丰富的功能。

  • 医疗设备: 在医疗监测设备中,GD32F303VET6可用于精确的传感器数据处理和无线通信功能,从而保证用户的健康监测和数据传输的准确性。

  • 汽车电子: 应用于传感器监测、车载控制系统等,从而提升汽车的智能化和安全性。

结论

GD32F303VET6凭借其高性能ARM Cortex-M4内核、丰富的外设接口和低功耗特性,成为广泛应用于嵌入式领域的重要单片机。无论是在工业控制、消费电子还是汽车电子领域,其强大而可靠的性能都可以为用户提供优质的体验。同时,Gigadevice的全面开发支持,使得开发者能够高效地进行产品设计,缩短开发周期,提升产品竞争力。在当前快速发展的智能科技时代,GD32F303VET6必将成为众多创新应用中不可或缺的核心元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.