WMSIC Electronic Components

Gigadevice GD32F310K8U6

ModelGD32F310K8U6
PackageQFN32
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
Gigadevice GD32F310K8U6
Type
GIGADEVICE
Minimum package
2940

Technical parameters

Electronic Component
GIGADEVICE
Electronic Component
GD32F310K8U6
Electronic Component
1
Package
QFN32
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.8g
CPU
ARM Cortex-M4
I / O
27
Electronic Component
1
ADC
12bit
Electronic Component
BM0259741774
CPU
72MHz
Electronic Component
2940
Electronic Component
64KB
Memory Type
FLASH

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32F310K8U6 产品概述

一、核心规格概览

GD32F310K8U6 是北京兆易创新(Gigadevice)推出的一款基于 ARM Cortex‑M4 内核的单片机,面向对实时控制和模拟采集有一定要求的嵌入式应用。主要参数包括:Cortex‑M4 内核,最高主频 72 MHz;片内程序存储器 64 KB(FLASH);片内工作 RAM 8 KB;通用 I/O 口多达 27 个;片内 12 位 ADC;封装为 QFN32。该器件在性能、存储与引脚资源之间取得平衡,适合资源受限但需较强算力的方案。

二、主要功能亮点

  • 实时性能:72 MHz 的 Cortex‑M4 内核适用于运动控制、闭环算法及 DSP 加速场景,相较于低频 Cortex‑M0/M3 有更好的数值处理能力。
  • 存储与运行空间:64 KB FLASH 可容纳中等复杂度固件与引导逻辑,8 KB SRAM 满足一般堆栈与数据缓冲需求。
  • 模拟采集:内置 12‑bit ADC 能进行分辨率较高的传感器采样,适合温度、光照、电流等模拟量采集与控制。
  • 丰富 I/O:多达 27 个 GPIO 便于外设扩展与接口复用,可实现多路开关、指示、外部中断等功能。
  • 封装小巧:QFN32 有利于体积受限的产品设计及生产成本控制。

三、外设与接口(概述)

GD32F310K8U6 在有限的引脚资源下通常提供常用的片上外设,包括多路定时器用于 PWM/定时、通用串行接口(USART、SPI、I2C 等常见总线)用于外设通信、看门狗与电源管理模块用于可靠性设计,以及 ADC 用于模拟采集。具体外设数量与复用情况请结合器件数据手册和封装引脚表进行详细核对与引脚分配。

四、典型应用场景

  • 小型电机控制与电子调速(低功率风扇、微型步进/直流电机)
  • 传感器数据采集与前端处理(环境监测、智能抄表、家居传感节点)
  • 工业控制中的逻辑单元与人机界面驱动(按键、指示灯、简单显示)
  • 消费类便携设备的主控芯片(带电量管理与外设接口需求的终端)

五、选型与设计注意事项

  • 电源与时钟:建议参考厂商推荐的供电范围与去耦方案,常见设计采用 3.3V 供电并在 VDD/VSS 做充分的去耦。
  • 引脚复用规划:QFN32 的引脚有限,早期在硬件设计阶段做好外设复用与 PCB 封装布线规划,以免后期功能受限。
  • 存储与升级:64 KB FLASH 对于需要频繁升级或复杂协议栈的应用需评估是否足够,必要时考虑外部存储或更大存储系列芯片。
  • 散热与封装工艺:QFN 封装热阻较小,注意焊盘设计与回流工艺,保证器件可靠焊接与散热。

六、开发与生态支持

GD32 系列通常兼容主流 ARM 工具链,支持 Keil MDK、GCC(arm‑none‑eabi)、IAR 等开发环境,并可利用 Gigadevice 提供的固件库与样例代码加速开发。投入量产前建议通过评估板或模块验证外设时序与功耗,结合厂商数据手册完成最终设计验证与认证准备。

总结:GD32F310K8U6 在小封装、适中算力与较丰富 I/O 之间提供了良好平衡,适合对成本、尺寸与实时性能有综合要求的嵌入式控制与传感应用。在最终选型前,请以兆易创新官方数据手册为准,核对电气参数与外设详细描述。

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