WMSIC Electronic Components

Gigadevice GD32F350G8U6TR

ModelGD32F350G8U6TR
PackageQFN-28-EP(4x4)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32F350G8U6TR
Type
GIGADEVICE
Minimum package
3000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD32F350G8U6TR
Electronic Component
1
Package
QFN-28-EP(4x4)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.157g
CPU
ARM Cortex-M4
I / O
24
Electronic Component
1
ADC
12bit
DAC
12bit
Electronic Component
BM0230042111
Operating Voltage
2.6V~3.6V
CPU
108MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32F350G8U6TR 产品概述

一、产品简介

GD32F350G8U6TR 是北京兆易创新(Gigadevice)推出的一款基于 ARM Cortex‑M4 内核的低功耗高性能单片机,适合对实时控制与模拟信号处理有一定要求的中小型嵌入式系统。芯片主频最高可达 108 MHz,片上程序存储采用FLASH,容量为 64 KB,片上 SRAM 为 8 KB,I/O 可用引脚数约 24 个,工作电压范围 2.6 V 至 3.6 V,封装为 QFN‑28‑EP(4×4)。

二、主要规格

  • CPU 内核:ARM Cortex‑M4,最高主频 108 MHz
  • 程序存储:64 KB FLASH(可作固件存储)
  • 数据存储:8 KB SRAM
  • I/O 数量:约 24 个通用 I/O 引脚
  • ADC:12‑bit 精度(适用于中等精度模拟采样)
  • DAC:12‑bit 精度(适用于模拟输出、音频或基准输出)
  • 工作电压:2.6 V ~ 3.6 V
  • 封装:QFN‑28‑EP(4×4)

三、片上外设与功能亮点

该系列芯片在有限的资源下集成了对嵌入式控制常用的片上外设,常见功能包括定时器、PWM、通用异步串行接口(UART)、SPI、I2C、12‑bit ADC/DAC 等,满足电机控制、传感器采集、通信与人机接口等多种应用场景。ARM Cortex‑M4 的 DSP 指令集与硬件乘法器为数字滤波、信号解调等提供了良好性能。

四、封装与电气设计要点

QFN‑28‑EP(4×4)封装利于散热与低寄生电阻,但对布局走线与焊接工艺有一定要求。电源设计建议采用稳定的 3.3 V 供电,关键点包括:

  • VDD/VSS 旁靠近封装放置 0.1 μF 与 1 μF 去耦电容;EP(散热引脚)焊盘接地良好;
  • 上电复位与 NRST 设计要可靠,留有复位电容或外部复位芯片根据系统需求;
  • 如果需高精度时钟或定时功能,可考虑外部晶振,常规情况下内部振荡器可满足大多数应用。

五、典型应用场景

适用于工业控制器、消费类电子的中端控制模块、传感器数据采集与处理、简单音频/模拟信号恢复、以及需要低功耗与实时性的便携式设备。结合 12‑bit ADC/DAC,可实现温度、压力等模拟量的采集与高精度控制输出。

六、开发与选型建议

  • 开发时优先使用支持 SWD 的调试工具进行固件下载与调试;
  • 根据系统规模评估 64 KB FLASH 与 8 KB SRAM 是否满足需求,若代码或数据更大需考虑更高容量器件;
  • 注意 I/O 引脚复用,提前规划外设占用以避免资源冲突;
  • 在电源噪声或模拟通道设计中,建议做好模拟地分割与滤波,保证 ADC/DAC 性能。

七、总结

GD32F350G8U6TR 在功耗、性能与片上外设之间提供了良好平衡,适合追求成本效益且需要 12‑bit 模拟能力与中等计算性能的嵌入式项目。选型时请结合实际的存储、I/O 与外设需求,合理评估是否满足系统长期扩展与可靠性要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.