Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GD25Q128EWIGR 是由 GigaDevice Semiconductor(香港有限公司)推出的一款高性能 NOR 闪存器件。作为一款非易失性存储器,GD25Q128EWIGR 采用先进的 SPI(串行外设接口)四 I/O 接口技术,具备高达 133 MHz 的时钟频率,适用于快速数据存储和处理需求。该产品具有 128 Mb(16M x 8)的存储容量,非常适合用于各种应用场景。
高容量与高性能:GD25Q128EWIGR 的存储容量为 128 Mb(16M x 8),可以满足对大数据量存储的需求。同时, 访问时间高达 7 ns,写周期时间为 70 µs(字)和 2.4 ms(页),保证了存取数据的高效率。
宽电压范围:该器件的供电电压范围为 2.7V 到 3.6V,适应多种电源设计需求,确保在不同的应用环境中都能正常运行。
工作温度范围:GD25Q128EWIGR 的工作温度范围为 -40°C 到 +85°C,使其不仅适合于室温环境,而且支持工业级应用,能够在严苛条件下稳定工作。
小型封装:该产品采用 8-WDFN(裸露焊盘,5x6 mm)封装,体积小巧,适合于对空间要求严格的电子产品设计。
广泛的应用:GD25Q128EWIGR 可广泛应用于汽车电子、物联网设备、消费电子、工业控制、网络和通信等领域,特别是在需要大容量存储和快速存取的场合。
GD25Q128EWIGR 的广泛应用涵盖多个领域:
GD25Q128EWIGR 是一款集高性能、高容量和广泛应用于一体的 NOR 闪存器件。凭借其优越的技术参数和可靠的工作性能,它为现代电子产品的设计与开发提供了强有力的支持。无论是在消费电子、工业控制还是物联网等领域,该产品都是一个值得信赖的选择,为用户带来优质的存储解决方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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