WMSIC Electronic Components

Gigadevice GD32F303VGT6

ModelGD32F303VGT6
PackageLQFP-100(14x14)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32F303VGT6
Type
GIGADEVICE
Minimum package
540 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD32F303VGT6
Electronic Component
1
Package
LQFP-100(14x14)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
2g
CPU
ARM Cortex-M4
I / O
80
Electronic Component
1
ADC
12bit
DAC
12bit
Electronic Component
BM0218825682
Operating Voltage
2.6V~3.6V
CPU
120MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32F303VGT6 产品概述

GD32F303VGT6 是由北京兆易创新(Gigadevice)推出的一款高性能微控制器(MCU)。该芯片基于 ARM Cortex-M4 内核,凭借其出色的处理能力和丰富的外设支持,广泛应用于工业控制、消费电子、智能家居、医疗设备等众多领域。作为一款中高端的单片机,GD32F303VGT6 在性能、功耗和成本之间实现了良好的平衡,适应了现代电子设备对低功耗和高效能的需求。

核心规格

GD32F303VGT6 基于 ARM Cortex-M4 内核,运行频率高达 108 MHz,具备较强的计算能力,适合进行复杂的算法处理和实时数据计算。该芯片集成了 96KB 的 SRAM 和 256KB 的 Flash 存储器,最大限度地满足用户对代码存储和数据处理的需求。

  • 核心架构: ARM Cortex-M4
  • 主频: 108 MHz
  • SRAM: 96KB
  • Flash: 256KB
  • 封装类型: LQFP-100 (14x14 mm)

丰富的外设

GD32F303VGT6 设计了众多外设,以支持多种应用的需求。其中包括多个高速 GPIO、定时器、ADC、DAC、UART、SPI、I2C 和 USB 等接口。具体外设支持如下:

  1. GPIO (通用输入输出): 提供灵活的 I/O 口配置,以支持多种外部设备的接口需求。
  2. 定时器和PWM模块: 支持多种定时操作,包括定时中断、周期性执行等功能,并能够产生 PWM 信号,适用于马达控制、调光等应用。
  3. 模拟数字转换器 (ADC): 集成多个 ADC 通道,支持高达 12 位的分辨率,适合于传感器数据采集等需求。
  4. 数模转换器 (DAC): 支持数字信号转化为模拟输出,适用于音频输出和控制环路。
  5. 串口通信接口: 支持 UART、SPI 和 I2C 通讯协议,为各种外设提供快速、稳定的数据交换方式。
  6. USB 2.0: 提供直接的 USB 接口,适合于需要外部连接的应用场景。

功耗优势

GD32F303VGT6 在性能优越的同时,通过精心设计的功耗管理策略,最大限度降低了运行时的功耗。其工作电压范围为 1.8V 至 3.6V,适合于低电压供电系统。通过丰富的低功耗模式,用户可以在不同场景下根据应用需求,有效管理电源,以延长设备的使用寿命。

应用场景

由于其强大的计算性能、丰富的外设及低功耗特性,GD32F303VGT6 被广泛应用于以下场景:

  1. 工业自动化: 适用于 PLC、HMI 和机器人控制等工业控制领域,能够高效实时控制设备。
  2. 消费电子: 在智能音箱、可穿戴设备等消费产品中提供强大的数据处理能力。
  3. 智能家居: 用于智能灯控、门锁系统、家庭安防等产品,提升家庭智能化程度。
  4. 医疗设备: 适合用于便携式监测设备和电子医疗仪器,这些设备通常要求高信噪比和快速响应。

开发支持

GD32F303VGT6 也提供了丰富的开发支持,包括硬件开发板、调试工具和软件开发环境。兆易创新为开发者提供了详尽的技术文档及示例代码,帮助用户快速上手。

结论

综上所述,GD32F303VGT6 是一款集高性能、低功耗和丰富外设于一体的强大微控制器,适合各类现代电子设备的设计需求。无论是工业控制、消费电子还是智能家居应用,GD32F303VGT6 都能提供可靠的解决方案,推动电子产品的创新与发展。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.