WMSIC Electronic Components

Gigadevice GD32C103RBT6

ModelGD32C103RBT6
PackageLQFP-64(10x10)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32C103RBT6
Type
GIGADEVICE
Minimum package
960

Technical parameters

Electronic Component
GIGADEVICE
Electronic Component
GD32C103RBT6
Electronic Component
1
Package
LQFP-64(10x10)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.33g
CPU
ARM Cortex-M4
I / O
51
Electronic Component
1
ADC
12bit
DAC
12bit
Electronic Component
BM0231087233
CPU
120MHz
Electronic Component
960
Electronic Component
128KB
Memory Type
FLASH

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32C103RBT6单片机产品概述

GD32C103RBT6是北京兆易创新(Gigadevice)推出的一款32位高性能单片机(MCU),基于ARM Cortex-M4内核架构,兼具高主频、丰富外设与可靠稳定性,广泛适配工业控制、智能家居、消费电子等多领域嵌入式开发需求。

一、核心性能参数

GD32C103RBT6搭载ARM Cortex-M4内核,集成数字信号处理(DSP)指令集与单精度浮点运算单元(FPU),相比传统Cortex-M3内核,在浮点运算、数字滤波等场景下性能提升显著,可高效处理复杂实时控制任务。

其CPU最大主频可达120MHz,时钟频率稳定,支持多任务并行处理,确保系统响应速度与实时性;同时兼容低功耗模式(睡眠、停机等),空闲状态下可降低功耗,延长设备续航。

二、存储资源配置

存储资源平衡性能与成本,满足多数嵌入式应用需求:

  • 128KB FLASH程序存储器:非易失性存储,擦写次数超10万次,支持代码加密保护,防止固件非法拷贝;
  • 32KB SRAM数据存储器:作为运行时数据缓存、栈堆空间,可快速读写临时变量、数组,支撑中等复杂度程序运行。

三、外设接口资源

提供丰富外设,适配多设备连接与信号处理:

  • 通用I/O口:共51个可用引脚(LQFP-64封装),支持数字输入/输出、中断触发、上拉/下拉配置,灵活连接传感器、按键、LED等;
  • 模拟接口:集成12位ADC(多通道采样)与12位DAC,实现模拟信号高精度采集与输出,适用于电压监测、模拟量控制;
  • 通信接口:内置UART、SPI、I2C等主流协议接口,可连接蓝牙/WiFi模块、传感器模组,支持设备间数据交互;
  • 定时器资源:包含高级定时器、通用定时器及看门狗,实现精准定时、PWM输出、系统故障监测,适配电机控制、定时调度。

四、封装与应用场景

采用LQFP-64封装(10×10mm),贴片式设计体积小巧,引脚间距0.8mm,便于PCB布线与焊接,适合小型化产品。

典型应用场景:

  1. 工业控制:小型PLC、电机驱动、数据采集模块(ADC采集现场信号,DAC输出控制指令);
  2. 智能家居:智能网关、温湿度传感器节点、家电控制模块;
  3. 消费电子:小型医疗设备(血糖仪、血压计)、便携式仪器、玩具电子;
  4. 物联网节点:低功耗数据传输节点(结合低功耗模式)、智能穿戴辅助控制单元。

五、品牌与可靠性

兆易创新作为国内领先半导体厂商,GD32系列具备自主知识产权,供货稳定且成本优势明显。GD32C103RBT6兼容STM32F103开发生态,拥有Keil/IAR编译器、例程代码与社区支持,降低开发门槛。

此外,该芯片支持工业级温度范围(-40℃~85℃),抗恶劣环境;具备ESD防护、抗干扰设计,提升复杂电磁环境下的稳定性。

总结:GD32C103RBT6以高性能Cortex-M4为核心,结合丰富存储/外设、小巧封装与可靠稳定性,是嵌入式开发中性价比优异的选择,覆盖多领域应用需求。

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