WMSIC Electronic Components

Gigadevice GD25LQ64ESIGR

ModelGD25LQ64ESIGR
PackageSOP-8208mil
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Gigadevice GD25LQ64ESIGR
Type
GIGADEVICE
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD25LQ64ESIGR
Electronic Component
1
Package
SOP-8208mil
Electronic Component
NOR FLASH
Electronic Component
0.35g
Electronic Component
1
Electronic Component
BM0229987227
Electronic Component
64Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.65V~2V
Current
10uA
Interface Type
SPI
Electronic Component
100000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD25LQ64ESIGR NOR FLASH 产品概述

一、产品定位与核心属性

GD25LQ64ESIGR是北京兆易创新(Gigadevice)推出的高速SPI NOR FLASH存储器,核心定位为低电压、工业级温度范围的通用存储方案。其以64Mbit(等效8MB)的存储容量为基础,适配1.65V~2V宽电压范围,支持最高133MHz SPI时钟速率,同时具备低待机功耗、高擦写寿命等特性,可满足消费电子、工业控制等多领域对存储的性能与可靠性需求。

二、关键性能参数解析

  1. 存储容量与接口:容量为64Mbit(二进制计算为8MB),采用标准化SPI接口,支持最高133MHz时钟频率,单SPI模式下数据传输速率可达133Mbps,可满足多数嵌入式系统的固件存储、数据读写需求。
  2. 电压与功耗:工作电压范围1.65V~2V,覆盖低功耗平台的供电需求;待机电流仅10uA,可显著延长电池供电设备的待机时间,降低系统整体功耗(尤其适合便携设备)。
  3. 擦写与写入效率:擦写寿命达100,000次,远高于普通NOR FLASH的10,000次标准,可支持频繁数据更新场景(如固件升级、日志存储);页写入时间(Tpp)为400us,每页通常为256字节,写入效率稳定,适合批量数据存储。
  4. 可靠性参数:数据保留时间(TDR)达20年,超过工业级存储10年的常规要求,可确保长期存储的数据不丢失;工作温度范围为-40℃~+85℃,覆盖工业级环境的温度波动,适应户外、车间等恶劣场景。

三、典型应用场景

GD25LQ64ESIGR的特性使其可适配多领域应用:

  1. 工业控制与物联网终端:工业级温度范围、低待机电流适合智能传感器、PLC模块等设备,满足户外部署或车间环境的稳定运行需求,同时低功耗减少系统散热。
  2. 消费电子与可穿戴设备:1.65V~2V低电压适配智能手表、蓝牙耳机等便携设备,10uA待机电流延长续航,64Mbit容量可存储固件、用户数据(如健康监测日志)。
  3. 通信模块与网络设备:133MHz高速SPI接口支持快速固件升级与数据读写,适合路由器、物联网网关等设备的存储需求,提升系统响应速度。
  4. 医疗电子设备:数据保留20年、高可靠性满足便携医疗设备(如血糖仪、健康监测仪)的存储要求,低功耗适配电池供电场景。

四、封装与可靠性设计

  1. 封装形式:采用SOP-8 208mil封装,属于小型化贴片封装,节省PCB布局空间,便于集成到紧凑的嵌入式系统中,同时兼容常规自动化贴装工艺,降低生产难度。
  2. 可靠性保障:除上述参数外,产品通过兆易创新的可靠性测试(如温度循环、湿度老化、ESD防护等),确保在工业环境下的长期稳定运行;擦写寿命与数据保留时间满足甚至超过行业标准,降低产品维护成本。

五、品牌与市场优势

作为兆易创新GD25LQ系列的核心产品,GD25LQ64ESIGR具备明显的市场优势:

  1. 本土品牌优势:兆易创新是国内存储芯片领域的龙头企业,产品供应链稳定,本地化服务完善,可快速响应客户的定制化需求与售后支持。
  2. 性能平衡:在低电压、高速率、低功耗与可靠性之间实现较好平衡,无需牺牲某一性能即可满足多场景需求,降低系统设计的兼容性风险。
  3. 成熟产品线:GD25LQ系列经过多年市场验证,兼容性强,可适配多数主流MCU(如STM32、NXP等)与嵌入式平台,缩短系统开发周期。

综上,GD25LQ64ESIGR是一款兼顾性能、功耗与可靠性的SPI NOR FLASH,适合对存储有高要求的嵌入式系统设计。

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