WMSIC Electronic Components

Gigadevice GD32F105RBT6

ModelGD32F105RBT6
PackageLQFP-64(10x10)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32F105RBT6
Type
GIGADEVICE
Minimum package
960 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD32F105RBT6
Electronic Component
1
Package
LQFP-64(10x10)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1.557g
CPU
ARM Cortex-M3
I / O
51
Electronic Component
1
ADC
12bit
DAC
12bit
Electronic Component
BM0149849623
Operating Voltage
2.6V~3.6V
CPU
108MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32F105RBT6 产品概述

基本信息

GD32F105RBT6 是一款由北京兆易创新(Gigadevice)推出的高性能单片机,基于 ARM Cortex-M3 内核,具备强大的处理能力和多种外设接口,非常适合嵌入式应用和智能硬件开发。该器件采用 LQFP-64 封装,尺寸为 10x10 毫米,适合在多种尺寸的电路板中使用。

技术规格

  • 核心架构:ARM Cortex-M3
  • 闪存:64KB
  • SRAM:128KB
  • 封装类型:LQFP-64 (10x10 mm)
  • 工作电压:通常为 3.3V
  • 操作频率:最高可达 72MHz
  • 工作温度范围:-40℃ 至 +85℃

关键特性

  1. 高性能处理能力:ARM Cortex-M3 核心具有出色的计算能力和低功耗特性,使得 GD32F105RBT6 在执行复杂算法和实时控制任务时表现出色。

  2. 丰富的外设接口:

    • 多个通用输入输出(GPIO)端口,支持灵活的外设扩展。
    • 集成多达 3 个通道的 USART,2 个 I2C 接口,多个 SPI 接口,方便与传感器、模块、其他 MCU、设备进行通信。
    • 支持 PWM、ADC 等功能,适用于电机控制、传感器数据采集等多种应用。
  3. 低功耗设计:在待机模式和低功耗运行模式下,GD32F105RBT6 具有较低的功耗,适合于移动设备和电池供电的应用场景。

  4. 高效的中断响应:支持多达 16 个外部中断源,适用于实时操作和事件驱动控制,可以快速响应外部变化。

  5. 开发支持:配合基于 ARM 的开发环境,支持丰富的软件开发工具和嵌入式开发平台,如 IAR、Keil 等,降低了开发难度和时间。

应用场景

GD32F105RBT6 适用于多种领域的嵌入式系统开发,以下是一些典型应用:

  • 工业控制:可用于自动化设备、PLC、传感器数据采集、控制电路等环节。
  • 智能家居:适合用于智能插座、智能灯泡、家居安防系统等应用中,实现设备的智能化管理。
  • 机器人控制:可用于开发运动控制系统,电机驱动及传感器信息的采集和处理。
  • 医疗设备:广泛应用于便携式医疗设备、监测仪器等,提供高可靠性和实时数据处理能力。
  • 物联网终端:作为 IoT 设备的核心控制单元,支持无线模块(如 Wi-Fi、蓝牙等)进行数据传输。

总结

GD32F105RBT6 作为一款功能强大的 ARM Cortex-M3 单片机,凭借其高性能、低功耗及丰富的外设接口,成为市场上非常受欢迎的选择。它不仅在许多嵌入式开发环境中提供了极大的灵活性,还为开发者带来了良好的使用体验。无论是在工业、家居、医疗还是 IoT 领域,GD32F105RBT6 都能满足高效、智能、可靠的设计需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.