Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Gigadevice GD32E230F4P6TR
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Gigadevice GD32E230F4P6TR
- Type
- GIGADEVICE
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- GIGADEVICE
- Electronic Component
- GD32E230F4P6TR
- Electronic Component
- 1
- Package
- TSSOP-20
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 0.244g
- CPU
- ARM Cortex-M
- I / O
- 15
- Electronic Component
- 1
- ADC
- 12bit
- Electronic Component
- BM0264718742
- Operating Voltage
- 1.8V~3.6V
- CPU
- 72MHz
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GD32E230F4P6TR 产品概述
一、产品简介
GD32E230F4P6TR是北京兆易创新（Gigadevice）推出的一款高性能单片机（MCU），它采用1.8V至3.6V的供电范围，适用于多种低功耗应用场景。该单片机具有15个通用输入输出（GPIO）引脚、4KB的RAM和16KB的Flash存储。其采用TSSOP-20封装，便于在空间有限的应用中实现集成。凭借强大的处理能力和灵活的外设配置，GD32E230F4P6TR在嵌入式控制、数据采集和消费电子产品中具有广泛的应用。
二、关键特性
供电电压范围：GD32E230F4P6TR工作电压范围为1.8V至3.6V，使其非常适合于低电压应用，可有效降低功耗，延长电池续航时间。
处理能力：搭载高性能的RISC架构内核，与传统的8051或AVR系列单片机相比，GD32E230F4P6TR提供更高的计算速度和数据处理能力，支持高效的嵌入式开发。
存储能力：内置4KB的RAM和16KB的Flash存储，支持用户程序的高效存储及数据缓存，适合复杂应用需求，如信号处理和算法实现。
引脚配置：其TSSOP-20封装提供足够的引脚配置，使开发人员可以灵活选择所需的功能，包括多个UART、SPI、I2C等通信接口，满足多种外设连接需求。
开发环境：GD32E230F4P6TR支持多种开发工具和软件平台，如Keil、IAR和GCC等，方便用户进行快速开发和调试。
三、应用场景
GD32E230F4P6TR适用于广泛的应用领域，包括但不限于：
消费电子：可用于智能家居设备、穿戴设备等，具备实时通讯能力和低功耗优点，满足现代家居和移动设备的发展需求。
工业控制：在工业自动化设备、传感器接口等场合中，GD32E230F4P6TR能够实时处理数据并与其他设备进行通信，提高生产自动化水平。
无线联网：具备多种通信接口，GD32E230F4P6TR可以与Wi-Fi或蓝牙模块连接，适合各种物联网应用，让设备能够联网。
传感器数据采集：支持多种外设连接，适合进行数据采集与处理，尤其是在环境监测和健康医疗方面具有明显优势。
四、总结
GD32E230F4P6TR是一款集成度高、功能强大的单片机，凭借其高效的性能、灵活的引脚配置和丰富的应用场景，展现出极大的市场潜力。它不仅适合技术开发人员使用，还能够为企业带来设备性能的提升以及更广泛的市场应用，推动了嵌入式技术和物联网的发展。信赖兆易创新（Gigadevice）品牌的用户，定能从GD32E230F4P6TR中获得优异的使用体验和更高的开发效率。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
