WMSIC Electronic Components

Gigadevice GD32F303VCT6

ModelGD32F303VCT6
PackageLQFP-100(14x14)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32F303VCT6
Type
GIGADEVICE
Minimum package
540 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD32F303VCT6
Electronic Component
1
Package
LQFP-100(14x14)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
2.033g
CPU
ARM Cortex-M4
I / O
80
Electronic Component
1
ADC
12bit
DAC
12bit
Electronic Component
BM0000514860
Operating Voltage
2.6V~3.6V
CPU
120MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32F303VCT6 产品概述

一、引言

GD32F303VCT6是由北京兆易创新(Gigadevice)推出的一款高性能单片机,属于GD32系列,其中集成了ARM Cortex-M4内核。这款单片机专为对计算能力和低功耗有严格要求的嵌入式应用而设计,广泛应用于消费电子、工业控制、智能家居、医疗设备等领域。GD32F303VCT6的核心特性使其能够在各种应用场景中表现出色。

二、主要特性

  1. 核心架构:

    • GD32F303VCT6基于ARM Cortex-M4内核,工作频率高达108MHz。Cortex-M4内核支持DSP指令集和浮点运算,能够高效处理复杂计算任务,适合对实时性能要求较高的应用。
  2. 存储容量:

    • 该单片机集成了48KB的SRAM和256KB的闪存,使得程序的存储和运行更为高效。丰富的存储空间能够支持复杂的算法和数据处理,对于一些需要实时数据监控和处理的应用尤为重要。
  3. 封装和尺寸:

    • GD32F303VCT6采用LQFP-100封装形式,封装尺寸为14x14mm,具有较小的占用空间,适合空间有限的设计。这种封装形式方便在高密度电路板上实现更紧凑的布局。
  4. 外设接口:

    • 该单片机支持丰富的外设接口,包括多个通用输入输出(GPIO)引脚、定时器、串口、I2C、SPI、ADC等,能够满足多种外部设备的连接需求。多达80个GPIO引脚的配置使得它能够处理多种输入输出信号,增强了系统的灵活性。
  5. 功耗特性:

    • GD32F303VCT6在运行时的功耗表现优异,适合低功耗应用场景。其可调的工作频率和多种低功耗模式使其在待机和运行状态下都能保持低能耗,延长产品的使用寿命。
  6. 开发及应用支持:

    • 北京兆易创新为GD32F303VCT6提供了全面的开发支持,包括丰富的软件库和开发工具(如GD32开发板、IDE等),方便开发者进行快速原型设计和功能验证。此外,产品的良好文档支持和社区资源也为工程师的后续开发提供了便利。

三、应用场景

GD32F303VCT6的设计适用于多种行业和领域,其主要应用场景包括但不限于:

  • 消费电子:如智能家居设备、音频处理器、便携式设备等,利用其强大的处理能力和丰富的接口实现多功能数据处理。
  • 工业控制:在自动化控制、传感器网络等由于其实时性和稳定性受到青睐。
  • 医疗设备:在便携式医疗监测设备中,可利用其高效的信号处理能力和低功耗特性。
  • 智能家居:能够为智能家居中的各类控制系统提供足够的计算能力和通信接口。

四、总结

GD32F303VCT6作为一款高性能单片机,凭借其强大的处理能力、丰富的存储空间和灵活的外设接口,成为现代嵌入式系统设计中的理想选择。其在多个领域的广泛应用也证明了其卓越的性能和可靠性。通过采用GD32F303VCT6,开发者能够轻松应对日益复杂的应用需求,推动智能产品的发展与创新。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.