WMSIC Electronic Components

Gigadevice GD32F470VIT6

ModelGD32F470VIT6
PackageLQFP-100(14x14)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32F470VIT6
Type
GIGADEVICE
Minimum package
540 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD32F470VIT6
Electronic Component
1
Package
LQFP-100(14x14)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
2.4g
CPU
ARM Cortex-M4
I / O
82
Electronic Component
1
ADC
12bit
DAC
12bit
Electronic Component
BM0221735032
CPU
240MHz
Electronic Component
Electronic Component
Electronic Component
540

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32F470VIT6 产品概述

GD32F470VIT6 是由中国北京兆易创新(Gigadevice)推出的一款高性能单片机(MCU),采用了 ARM Cortex-M4 架构,提供了强大的计算能力以及灵活的应用范围。作为 GD32 系列中的重要一员,GD32F470VIT6 以其出色的性能、丰富的外设接口和低功耗特性,广泛应用于物联网、工业控制、智能家居、汽车电子等领域。

核心性能

GD32F470VIT6 搭载了最大主频为 168 MHz 的 ARM Cortex-M4 处理器,具备优秀的指令执行速度和计算能力,支持浮点运算和数字信号处理,适合进行复杂信号处理和高频实时数据处理。同时,该 MCU 内置了 768KB 的 SRAM 和 2MB 的 Flash 存储器,为用户提供了充足的存储空间进行应用程序开发和数据存储。

封装与接口

GD32F470VIT6 采用了 LQFP-100(14x14 mm)封装,具有 100 引脚,方便用户进行焊接与插接。此款 MCU 提供了丰富的外部接口支持,包括 GPIO、多个 USART、I2C、SPI、CAN 等通信接口,能够满足多种外设连接需求。同时,还配备了多达 16 个通用 ADC 通道以及多个定时器,适合实现各种控制逻辑和数据采集功能。

功耗特性

在功耗方面,GD32F470VIT6 采用了先进的工艺和低功耗设计策略,使其在不同工作模式下都能保持较低的功耗,这一点在电池供电的移动设备和需要长时间运行的嵌入式系统中尤为重要。该单片机支持多种待机模式和省电策略,以延长设备的整体工作时间。

技术优势

  1. 高性能:基于 ARM Cortex-M4 的设计,使得 GD32F470VIT6 在运行速度和运算效率上都具备了明显优势,能够处理复杂应用需求。

  2. 丰富的外设支持:集成多种通信接口和外设,为系统设计提供了灵活性和可扩展性。

  3. 强大的存储能力:768KB 的 SRAM 和 2MB 的 Flash 为应用程序提供了丰富的存储空间,支持大型程序和数据的灵活处理。

  4. 低功耗设计:支持多种电源管理模式,适合需要长时间运行和低功耗的应用场景。

应用领域

GD32F470VIT6 单片机因其卓越的性能与多样的功能,适用于多种应用场景,包括但不限于:

  • 物联网设备:适合智能家居、智慧城市、环境监控等 IoT 应用,提供流畅的数据交互和实时处理能力。

  • 工业自动化:可用于设备控制、远程监控和数据采集,为工业生产提供可靠的控制和提高效率。

  • 消费电子:广泛应用于智能手表、智能音响等消费电子产品,提供良好的用户体验。

  • 汽车电子:适合用于汽车控制系统、车载信息娱乐系统等领域,增强汽车的智能化和安全性。

开发环境

为了便于开发者使用 GD32F470VIT6,Gigadevice 提供了一系列工具和资源,包括官方的开发板、软件开发工具(如 Keil、IAR 等),以及丰富的库文件和示例代码,帮助开发者快速上手并实现自己的创新应用。

结论

GD32F470VIT6 作为一款高性能、低功耗的单片机,以其先进的技术和丰富的资源,在嵌入式系统设计和应用开发中展现出极大的潜力。无论是在物联网、工业控制还是消费电子领域,其性能和功能都能够满足严格的应用要求,是开发者理想的选择之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.