WMSIC Electronic Components

Gigadevice GD32F330R8T6

ModelGD32F330R8T6
PackageLQFP-64(10x10)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32F330R8T6
Type
GIGADEVICE
Minimum package
960 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD32F330R8T6
Electronic Component
1
Package
LQFP-64(10x10)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1.92g
CPU
ARM Cortex-M4
I / O
55
Electronic Component
1
ADC
12bit
Electronic Component
BM0229933616
CPU
84MHz
Electronic Component
Electronic Component
Electronic Component
960
Electronic Component
64KB

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32F330R8T6 产品概述

一、产品简介

GD32F330R8T6 是兆易创新(Gigadevice)推出的一款基于 ARM Cortex-M4 内核的单片机,面向对计算性能和外设兼容性有中等要求的嵌入式应用。器件采用 Flash 型程序存储器,程序存储容量为 64KB,最高主频可达 84MHz,提供 55 个可用 I/O,引脚封装为 LQFP-64(10×10)。

二、核心性能特点

  • CPU 内核:ARM Cortex-M4,具备良好的数值处理与 DSP 指令支持,适合对实时性有要求的控制任务。
  • 主频与存储:最高 84MHz 主频,64KB Flash 程序存储,适用于中小型固件与应用逻辑。
  • A/D 能力:集成 12-bit ADC,可满足多数传感器数据采集与模拟量测量需求。
  • I/O 与封装:提供 55 个通用 I/O,可灵活配置为 GPIO、外设复用等;LQFP-64(10×10)封装便于开发板与量产 PCB 设计。

三、典型应用场景

  • 传感器数据采集与处理:利用 12-bit ADC 进行温度、压力、光照等模拟量采样,并用 Cortex-M4 进行滤波与预处理。
  • 运动与电机控制:适合轻中型电机驱动与位置控制,利用 MCU 的实时性实现闭环控制策略。
  • 工业控制与仪表:在 I/O 数量与存储空间受限但需稳定运行的场景下表现良好。
  • 消费类与嵌入式网关:作为分布式节点或边缘控制单元,承载协议解析与外设管理。

四、设计与选型建议

  • 存储与固件:64KB Flash 对于功能模块化、库裁剪与 OTA 要求需谨慎规划;复杂协议或大量日志可能需外扩存储。
  • 电源与时钟:为保证 ADC 精度与系统稳定性,建议在硬件上做好电源滤波与时钟布线,避免模拟与数字干扰叠加。
  • PCB 布局:LQFP-64 封装对走线有一定密度要求,建议按厂商封装手册设计焊盘与过孔,注意热管理与地平面。
  • 开发资源:基于 Cortex-M4,常见开发工具链与调试接口支持较好,选择合适的 IDE 与调试器可加速开发周期。

五、总结

GD32F330R8T6 在 84MHz 的主频与 64KB Flash 配置下,结合 55 路 I/O 与 12-bit ADC,提供了均衡的计算能力与外设扩展性。适合中等复杂度的实时控制与数据采集类项目,是需要在性能、尺寸与成本之间取得平衡的可靠选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.