WMSIC Electronic Components

Gigadevice GD32F427ZET6

ModelGD32F427ZET6
PackageLQFP-144(20x20)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32F427ZET6
Type
GIGADEVICE
Minimum package
360 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD32F427ZET6
Electronic Component
1
Package
LQFP-144(20x20)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
2.4g
CPU
ARM Cortex-M4
I / O
114
Electronic Component
1
ADC
12bit
DAC
12bit
Electronic Component
BM0224752951
CPU
200MHz
Electronic Component
Electronic Component
Electronic Component
360

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32F427ZET6 产品概述

概要

GD32F427ZET6 是由北京兆易创新科技有限公司(Gigadevice)开发的高性能单片机(MCU),属于GD32F4系列。该芯片采用ARM Cortex-M4内核,提供强大的处理能力和丰富的外设资源,适用于各种高要求的嵌入式应用。

核心特性

  • CPU 内核: 基于ARM Cortex-M4内核,支持单精度浮点运算,最大主频可达200MHz。
  • 存储资源:
    • 程序存储器: 512KB FLASH,支持读写和擦除操作。
    • 数据存储器: 内置SRAM,确保高速数据处理。
  • 外设资源:
    • ADC: 12位分辨率的模拟-数字转换器,支持多个通道和高精度转换。
    • DAC: 12位分辨率的数字-模拟转换器,用于生成高精度的模拟信号。
    • GPIO: 提供114个通用输入/输出端口,满足多种接口和控制需求。

包装和封装

GD32F427ZET6 采用LQFP-144封装,尺寸为20x20mm。这种封装方式不仅提供了足够的引脚数量,还确保了良好的热散热性能和可靠性。

应用场景

由于其强大的处理能力和丰富的外设资源,GD32F427ZET6 适用于以下应用场景:

  • 工业控制: 支持多种通信协议(如UART、SPI、I2C、CAN等),可用于工业自动化、机器人控制等领域。
  • 医疗设备: 高精度的ADC和DAC使其特别适合医疗设备中的信号采集和处理,如心率监测、血压监测等。
  • 消费电子: 可用于智能家居、穿戴设备、智能仪表等消费电子产品中。
  • 汽车电子: 支持CAN总线协议,适用于汽车电子系统中的控制和通信。

开发支持

为了帮助开发者快速上手,Gigadevice 提供了以下开发支持:

  • 开发板: 专用开发板,包含必要的外设和接口,方便用户进行评估和开发。
  • 软件开发工具链: 支持Keil、IAR、GCC等主流编译器,并提供丰富的库函数和示例代码。
  • 技术文档: 详细的数据手册、用户手册和应用笔记,帮助开发者深入了解芯片的功能和使用方法。

能耗和可靠性

GD32F427ZET6 采用低功耗设计,支持多种工作模式(如睡眠模式、待机模式等),以减少能耗。在可靠性方面,芯片经过严格的测试和验证,确保在各种环境条件下稳定运行。

总结

GD32F427ZET6 是一款高性能、功能丰富的单片机,通过其强大的ARM Cortex-M4内核和多种外设资源,能够满足各种复杂应用的需求。其低功耗设计、可靠性保证以及完善的开发支持,使其成为嵌入式系统开发者的理想选择。无论是在工业控制、医疗设备还是消费电子领域,GD32F427ZET6 都能提供出色的性能和灵活性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.