WMSIC Electronic Components

Gigadevice GD32F307VGT6

ModelGD32F307VGT6
PackageLQFP-100(14x14)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32F307VGT6
Type
GIGADEVICE
Minimum package
540 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD32F307VGT6
Electronic Component
1
Package
LQFP-100(14x14)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
2.53g
CPU
ARM Cortex-M4
I / O
80
Electronic Component
1
ADC
12bit
DAC
12bit
Electronic Component
BM0258735878
CPU
120MHz
Electronic Component
Electronic Component
Electronic Component
540

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32F307VGT6 产品概述

一、产品简介

GD32F307VGT6 是北京兆易创新(Gigadevice)推出的一款高性能 32 位单片机,基于 ARM Cortex-M4 内核,最高主频可达 120 MHz。器件集成高达 1 MB 的 Flash 程序存储和 96 KB 片上 SRAM,以及丰富的片上外设,面向实时控制、数据采集与信号输出等要求较高的嵌入式应用场景。

二、核心规格

  • CPU 内核:ARM Cortex-M4(支持 DSP 指令集),最高主频 120 MHz
  • 程序存储:1 MB Flash
  • 片上静态 RAM:96 KB
  • 通用输入/输出(GPIO):约 80 个可用 I/O 引脚
  • 模数转换:12 位 ADC(多通道,高采样精度)
  • 数模转换:12 位 DAC(高精度模拟输出)
  • 封装:LQFP-100(14 x 14 mm)
  • 品牌:Gigadevice(北京兆易创新)

三、关键特性与优势

  • 性能比:Cortex-M4 架构与 120 MHz 主频组合,提供优秀的实时响应能力和数字信号处理性能,适合电机控制、闭环控制与滤波等任务。
  • 精度与接口:12-bit ADC 与 12-bit DAC 的并存,使器件在模拟信号采集与精确模拟输出上具有优势,便于传感器读数、回路控制及音频/模拟接口应用。
  • 丰富 I/O:约 80 个 GPIO 为模块化设计、扩展外设与多路 I/O 接入提供充分空间,利于复杂系统集成。
  • 大容量程序空间:1 MB Flash 可容纳大型固件、Bootloader 与多任务功能实现,减少对外部存储器的依赖。
  • 生态与支持:兼容主流工具链(如 Keil MDK、IAR、GNU GCC);兆易创新提供的固件库与示例可加速开发与验证。

四、典型应用场景

  • 工业控制与伺服驱动:实时控制算法、速度/位置闭环、PWM 输出配合多通道 ADC 做反馈读取。
  • 数据采集与信号处理:多通道高精度 ADC 适合传感器阵列、环境监测与数据记录。
  • 精密模拟输出:12-bit DAC 可用于模拟量控制、参考源或音频信号输出。
  • 通用嵌入式系统:人机界面、通信网关、仪表与医疗设备等对性能与可靠性有较高要求的场合。

五、开发与选型建议

  • 电源与时钟:为保证 ADC/DAC 精度与系统稳定性,应采用低噪声电源与良好的 PCB 布局,注意模拟地与数字地分离。
  • 外设复用:在设计时需合理规划引脚复用,LQFP-100 封装提供充足引脚但仍应预留扩展口。
  • 软件支持:建议基于厂商固件库或 CMSIS 架构快速建立驱动层,并在关键实时任务中利用 M4 的 DSP 指令优化算法。
  • 散热与封装:LQFP-100 封装在高频与高负载应用下需考虑热管理与可靠性验证。

总体而言,GD32F307VGT6 以其高主频、大容量存储与丰富的模拟/数字外设,适合对实时性、精度和接口数量有较高要求的嵌入式项目,是工业与消费类产品的良好选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.