WMSIC Electronic Components

Gigadevice GD32F103VGT6

ModelGD32F103VGT6
PackageLQFP-100(14x14)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32F103VGT6
Type
GIGADEVICE
Minimum package
540 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD32F103VGT6
Electronic Component
1
Package
LQFP-100(14x14)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
2.91g
CPU
ARM Cortex-M3
I / O
80
Electronic Component
1
ADC
12bit
DAC
12bit
Features
Built-in General Purpose; positions(NRST)
Electronic Component
BM0228725053
Operating Voltage
2.6V~3.6V
CPU
108MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32F103VGT6 32位微控制器产品概述

一、核心性能与架构基础

GD32F103VGT6搭载ARM Cortex-M3高性能32位内核,这是专为嵌入式实时系统优化的架构,支持Thumb-2指令集——既保留16位指令的代码密度(减少存储占用),又具备32位指令的运算效率(提升执行速度)。其最大主频可达108MHz,较同系列基础型号提升约50%,能快速处理多任务调度、数据运算等需求(如工业现场的实时数据采集反馈、智能家居的多设备联动)。此外,内核集成嵌套向量中断控制器(NVIC),支持43个可配置中断,中断响应时间低至1.2μs,确保关键任务的实时性。

二、存储与接口资源配置

(存储系统)

程序存储采用1MB大容量FLASH,可直接存储复杂固件(如带简单GUI的小型控制系统),无需额外扩展外部存储器;配套96KB SRAM(含64KB系统SRAM+32KB备份SRAM),其中备份SRAM可通过VBAT引脚供电,掉电后仍能保存设备配置、传感器校准数据等关键信息。

(接口资源)

  • 数字I/O:共80个通用输入输出引脚,覆盖LQFP-100封装的大部分可用引脚,支持上下拉配置、中断触发,可灵活扩展按键、LED、继电器等外设;
  • 模拟接口:集成12位ADC(16通道)与12位DAC(2通道),ADC采样率达1Msps,能高精度采集温度、压力、电流等模拟信号;DAC支持稳定模拟量输出(如控制电机转速、输出音频信号);
  • 通信接口:标准配置含SPI、I2C、UART等常用通信接口,适配WiFi、蓝牙模块、传感器等外设,无需额外硬件扩展。

三、封装与工作特性

(封装形式)

采用LQFP-100封装(14×14mm,引脚间距0.5mm),兼顾引脚数量与尺寸:100引脚提供充足资源扩展空间,14×14mm尺寸适合紧凑PCB设计,便于批量生产与焊接。

(工作特性)

  • 电压范围:2.6V~3.6V,适配3.3V供电系统(电池、线性电源),低电压下仍稳定运行;
  • 温度范围:标准工业级(-40℃~85℃),可适应工业现场、车载等恶劣环境;
  • 低功耗设计:支持睡眠模式(≈10mA)、停机模式(≈2μA)、待机模式(≈0.5μA),适合电池供电的便携式设备(如智能手环、无线传感器节点),延长续航。

四、典型应用场景

GD32F103VGT6的资源配置覆盖多领域需求,典型应用包括:

  1. 工业控制:作为小型PLC核心,通过80个IO扩展数字量输入输出,12位ADC采集现场传感器数据,实现设备状态监测与控制;
  2. 智能家居:作为传感器节点或控制终端,低功耗模式适配电池供电,通信接口扩展WiFi模块实现远程控制(如灯光、窗帘);
  3. 消费电子:用于智能音箱辅助控制、小型游戏机核心,1MB FLASH存储固件与用户数据,稳定电压适配各类电源;
  4. 汽车电子:工业级温度范围适配车载环境,可用于胎压监测节点、小功率电机控制(如车窗升降)。

五、总结

GD32F103VGT6凭借高性能内核、丰富资源、灵活封装及低功耗特性,成为嵌入式开发中极具性价比的选择。其覆盖从入门到中高端应用场景,适合快速原型设计与量产,是替代部分国外同类产品的理想方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.