WMSIC Electronic Components

Gigadevice GD32F310G8U6TR

ModelGD32F310G8U6TR
PackageQFN28
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32F310G8U6TR
Type
GIGADEVICE
Minimum package
3000

Technical parameters

Electronic Component
GIGADEVICE
Electronic Component
GD32F310G8U6TR
Electronic Component
1
Package
QFN28
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1.5g
CPU
ARM Cortex-M4
I / O
23
Electronic Component
1
ADC
12bit
EEPROM
128KB
Electronic Component
BM0258677459
CPU
72MHz
Electronic Component
3000
Electronic Component
64KB
Memory Type
FLASH

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32F310G8U6TR 产品概述

一、概述

GD32F310G8U6TR 是北京兆易创新(Gigadevice)推出的一款基于 ARM Cortex‑M4 内核的低功耗 32 位单片机,面向体积受限且需要一定实时计算能力的嵌入式应用。器件主频最高可达 72 MHz,结合丰富的模拟与通信外设,适用于传感采集、控制驱动与小型智能终端等场景。

二、主要规格

  • CPU 内核:ARM Cortex‑M4
  • 最大主频:72 MHz
  • 程序存储器:64 KB Flash
  • EEPROM:128 KB(用户数据存储)
  • SRAM:8 KB
  • 可用 I/O:23 路通用 I/O
  • ADC:12‑bit 分辨率模拟‑数字转换
  • 封装:QFN‑28‑EP(4×4 mm)
  • 品牌:Gigadevice(北京兆易创新)

三、主要特性与外设

  • 基于 Cortex‑M4 架构,适合数字滤波与控制类算法的实时运算;指令集对 DSP 运算有友好支持。
  • 内置 12‑bit ADC,满足常规传感器采集精度需求。
  • 常见片上外设包括多路通用定时器、串口(USART/UART)、SPI、I2C、看门狗与系统时钟管理(具体通道数请参见数据手册)。
  • 支持标准调试接口(SWD),便于软件开发与故障诊断。
  • QFN‑28‑EP 的裸露散热焊盘有利于热管理与接地。

四、典型应用场景

  • 便携式与消费类电子设备的控制与传感采集;
  • 物联网节点与智能传感器网关;
  • 小型工业控制、家用电器控制与人机界面子模块;
  • 需要一定实时处理能力的电机驱动初级控制与 PWM 输出场合(视具体外设能力而定)。

五、封装与开发注意事项

  • QFN‑28‑EP(4×4 mm)适合空间受限设计,PCB 布局时建议为裸露焊盘预留足够的接地焊盘与热通孔以利散热与可靠焊接。
  • 设计时关注 I/O 数量与外设复用,合理规划管脚功能以避免资源冲突;外设具体功能与引脚映射请参考官方引脚图。
  • 电源、晶振与 ADC 参考接地布线要做好去耦与低噪设计,保证模数转换精度与系统稳定性。
  • 推荐使用 Keil、IAR 或 GCC 等主流 ARM 工具链进行开发,并配合兆易官方提供的固件库与示例代码以加速开发。

六、选型建议

在选型前请确认项目对闪存、EEPROM 与 SRAM 的容量需求、实际 I/O 与外设数量要求以及封装尺寸限制。如有对更高性能或更多外设的需求,可对比同系列或其他型号,或向供应商索取完整数据手册与参考设计以获得详细电气参数与时序信息。

如需获取完整数据手册、引脚配置表或开发板建议,请联系供应渠道或访问兆易创新官网下载资料。

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