WMSIC Electronic Components

Gigadevice GD32F427VGT6

ModelGD32F427VGT6
PackageLQFP-100(14x14)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32F427VGT6
Type
GIGADEVICE
Minimum package
540

Technical parameters

Electronic Component
GIGADEVICE
Electronic Component
GD32F427VGT6
Electronic Component
1
Package
LQFP-100(14x14)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
4.4g
CPU
ARM Cortex-M4
I / O
82
Electronic Component
1
ADC
12bit
DAC
12bit
Electronic Component
BM0212433553
CPU
200MHz
Electronic Component
540
Electronic Component
1MB
Memory Type
FLASH

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32F427VGT6 产品概述

GD32F427VGT6 是北京兆易创新(Gigadevice)推出的一款高性能单片机,属于 GD32 系列,基于 ARM Cortex-M4 架构,旨在满足嵌入式系统中对高效能和低功耗的严苛要求。这款单片机凭借其先进的处理能力和丰富的外设接口,成为许多应用场景的理想选择。

1. 处理能力

GD32F427VGT6 采用了 32 位 ARM Cortex-M4 处理器,最高主频可达 168MHz。Cortex-M4 核心支持 DSP 指令集和浮点运算,使其在处理复杂的数学运算和信号处理任务时表现出色。搭载 256KB 的内部 SRAM 和 1MB 的闪存,使得用户能够更灵活地进行应用开发,存储大量数据和程序。此外,具有较大的内存容量,适合运行复杂的应用程序和实时操作系统(RTOS)。

2. 封装与尺寸

GD32F427VGT6 采用 LQFP-100 封装(14x14mm),其具有平整的引脚输出,便于PCB设计和焊接。LQFP 封装的设计不仅有助于散热,还能够在更紧凑的空间内实现更高的集成度,适用于高密度电子设备的开发。引脚分布合理,使得用户在引脚连接时更为方便,降低了设计难度。

3. 外设接口

GD32F427VGT6 提供丰富的外设接口,增强了其在多种应用场景下的灵活性。它支持多种通信接口,包括但不限于:

  • SPI: 用于高速数据传输,适合于与传感器或存储设备之间的数据交互。
  • I2C: 适合于多个外设的连接,用于控制和监测。
  • UART: 支持串口通信,便于与计算机或其他设备进行数据交换。
  • CAN: 提供高效且可靠的网络通信,适合于汽车和工业自动化等应用。

此外,GD32F427VGT6 还带有 ADC、DAC 和定时器等多种功能模块,为用户的应用开发提供了更多的选择。

4. 低功耗设计

GD32F427VGT6 具备多种低功耗模式,支持动态电源管理,可以在不需要高性能计算时自动进入低功耗状态。这种设计不仅有效延长了电池供电设备的工作时间,也降低了整体能耗,符合现代电子产品追求绿色环保的趋势。

5. 应用场景

GD32F427VGT6 被广泛应用于工业自动化、物联网、消费类电子、智能家居等领域。其卓越的性能和丰富的外设接口,能够满足智能控制系统、数据采集和处理等多样化需求。在嵌入式系统中能够承担从数据采集、信号处理到控制反馈等各个环节,提高了系统整体性能。

总结

GD32F427VGT6 作为一款基于 ARM Cortex-M4 执行架构的单片机,结合了强大的数据处理能力和多种外设支持,不仅适合于复杂应用的运算需求,同时也兼顾了功耗控制方面的优势。由于其高性价比、低功耗和丰富的外设接口,GD32F427VGT6 必将在未来的电子产品开发中扮演重要角色,为设计师和工程师提供更为丰富的选择和更高的产品竞争力。无论是新项目的开发,还是现有产品的升级,GD32F427VGT6 将为用户提供理想的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.