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Gigadevice GDP2BFLM-CB GDP2BFLM
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- Gigadevice GDP2BFLM-CB
- Type
- GIGADEVICE
- Minimum package
- 1980 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- GIGADEVICE
- Electronic Component
- GDP2BFLM-CB
- Electronic Component
- 1
- Package
- FBGA-96
- Electronic Component
- DDR SDRAM
- Electronic Component
- 1.261g
- Electronic Component
- 1
- Electronic Component
- BM0264572682
- Electronic Component
- 4Gbit
- Operating Temperature
- 0℃~+95℃
- Operating Voltage
- 1.35V~1.5V
- Electronic Component
- Electronic Component
- Electronic Component
- 1980
- Memory
- DDR3L SDRAM
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GDP2BFLM-CB 产品概述
一、特点概述
GDP2BFLM-CB 为北京兆易创新（Gigadevice）出品的 DDR3L SDRAM 器件，单颗存储容量 4Gbit，支持低电压工作模式（1.35V）并兼容 1.5V。器件采用 FBGA-96 封装，体积小、引脚密度高，适合对空间、功耗有严格要求的嵌入式及消费类产品。器件遵循 DDR3/DDR3L 接口规范，提供稳定的数据传输性能与良好的兼容性。
二、主要规格
- 存储构架：DDR3L SDRAM（JEDEC 兼容）
- 存储容量：4Gbit
- 工作电压：1.35V（低压模式），兼容 1.5V
- 工作温度：0°C ~ +95°C
- 封装形式：FBGA-96
- 品牌：Gigadevice（北京兆易创新）
三、封装与机械特性
FBGA-96 封装在保证高密度集成的同时利于热量分布与信号完整性，适用于多层 PCB 布局。推荐按制造商提供的焊接回流曲线进行贴片与回流，注意球间距与焊盘设计，确保可靠焊接与长期机械稳定性。
四、典型应用
- 嵌入式主控与系统级芯片（SoC）外部存储扩展
- 网络设备与通信终端缓存
- 多媒体播放与图像处理模块的临时数据存储
- 工业自动化与数据记录设备（适合高温场景，但非耐低温-40°C 场合）
五、设计与使用注意事项
为保证数据完整性与系统稳定性，建议在 PCB 布局与电源管理上注意：
- 在 VDD、VDDQ 近端放置足够的去耦电容，降低电源噪声；
- 严格控制数据与地址线的阻抗匹配与长度匹配，减少串扰与延迟偏差；
- 使用合适的终端电阻与飞线策略，遵循 JEDEC 推荐的信号完整性指导；
- 在 1.35V 低压模式与 1.5V 兼容模式间切换时，确认系统电源与控制器支持相应时序与电压等级。
六、可靠性与品质保证
GDP2BFLM-CB 适配广泛温度范围（0–95°C），通过出厂测试和静电、温度循环等可靠性验证。为获得长期性能与稳定供货，建议在设计初期与供应商确认产品生命周期、BOM 兼容性与后续支持策略。
结语：GDP2BFLM-CB 以其 4Gbit 密度、DDR3L 低压特性及紧凑 FBGA-96 封装，能够满足对功耗、体积和传输性能有综合要求的终端与嵌入式系统存储需求。在具体应用中应结合 PCB 设计与电源管理细化实现方案，以发挥器件最佳性能。
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