WMSIC Electronic Components

GATEMODE GM1302

ModelGM1302
PackageSOIC-8
BrandGATEMODE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GATEMODE GM1302
Type
GATEMODE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GATEMODE
Electronic Component
GM1302
Electronic Component
1
Package
SOIC-8
Electronic Component
Real-Time Clock (RTC)
Electronic Component
0.189g
Electronic Component
1
Features
Power Management and Battery; SRAM / NVRAM
Electronic Component
BM0264071541
Operating Temperature
40℃~+85℃
Operating Voltage
2V~5.5V
Operating Current
1.2mA
Interface Type
SPI
Crystal Oscillator Type
Electronic Component
Static Current(Iq)
1nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GM1302 实时时钟(RTC)产品概述

GM1302是捷茂微(GATEMODE) 推出的工业级低功耗实时时钟芯片,针对嵌入式系统、电池供电设备等场景优化设计,核心聚焦“超长续航+宽环境适配”,可精准记录时间、日期及闹钟功能,是物联网、消费电子、工业控制等领域的高性价比时钟解决方案。

一、产品定位与核心价值

GM1302的设计目标是解决低功耗场景下的精准时钟需求,核心价值体现在三大维度:

  1. 超长续航:静态电流仅1nA,搭配纽扣电池可实现数十年续航,彻底解决电池供电设备的频繁换电痛点;
  2. 宽环境适配:-40℃~+85℃工业级温区,兼容户外、车载等恶劣工况;
  3. 高集成易集成:SPI接口+SOIC-8小封装,无需复杂外围电路,可快速嵌入各类PCB设计。

二、关键电气参数深度解析

GM1302的参数精准匹配低功耗场景,核心参数的实际意义需重点关注:

1. 静态电流(Iq):1nA

静态电流是RTC待机时的核心指标,1nA处于行业领先水平。以CR2032纽扣电池(容量≈220mAh)为例,理论续航可达:
[ \text{续航时间} = \frac{220,\text{mAh}}{1,\text{nA}} = 220 \times 10^6,\text{h} \approx 25114,\text{年} ]
实际应用中因电池自放电、晶振损耗等影响,续航仍可达10年以上,远优于同类产品(常规RTC静态电流多在10nA~100nA之间)。

2. 工作电压范围:2V~5.5V

兼容3.3V(嵌入式主流)和5V(传统MCU)电源,无需电平转换;同时覆盖纽扣电池(2.7V~3.6V)的电压波动,适配所有电池供电场景。

3. 动态工作电流:1.2mA

读写时钟、设置闹钟时的动态电流仅1.2mA,远低于同类产品的5mA~10mA,读写操作对续航影响可忽略。

4. 耗散功率(Pd):0.001mW

静态耗散功率1μW,无发热问题,延长芯片寿命。

5. 晶振设计:外置32.768kHz

采用外置晶振方案,用户可根据精度需求选择不同等级的32.768kHz晶振(如工业级±5ppm,年误差≈2.6分钟),灵活性高于内置晶振芯片。

三、接口与封装特性

1. SPI串行接口

GM1302采用3线SPI接口(CLK时钟、DATA双向数据、CE片选),通信速率最高1MHz,支持多芯片级联(通过CE区分),比I2C抗干扰能力更强,适合高速读写场景。

2. SOIC-8小封装

封装尺寸约5.2mm×5.2mm,表面贴装工艺,适配高密度PCB布局(如智能手环、物联网节点);引脚功能清晰(含VCC、GND、晶振X1/X2、SPI三线、备用电源等),无需额外转换。

四、典型应用场景

GM1302覆盖多领域需求:

  1. 电池供电设备:智能手环、电子秤、便携式血糖仪(低功耗+长续航);
  2. 物联网终端:环境监测传感器(温湿度、光照)、智能门锁(宽温+SPI易集成);
  3. 工业与车载:车载仪表盘时钟、PLC控制模块(-40℃~+85℃工业级温区);
  4. 消费电子:电子钟、数码相框、机顶盒(精准时间+低待机功耗)。

五、使用注意事项

  1. 晶振选型:必须搭配32.768kHz工业级晶振,X1/X2并联10pF~15pF负载电容,保证精度;
  2. 电源管理:主电源(VCC)与备用电源(Vbat)需隔离,主电源断开时自动切换至备用电源;
  3. SPI通信:CE通信前拉低、结束后拉高,时钟频率≤1MHz,避免数据错误;
  4. 温区适配:-40℃环境需用耐低温晶振,避免精度下降;
  5. 静态功耗优化:确保芯片无额外漏电流,否则会增加实际静态电流。

GM1302凭借“超低静态功耗+宽适配性+高性价比”,成为低功耗时钟场景的首选芯片,可满足绝大多数嵌入式系统的时钟需求。

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