WMSIC Electronic Components

HGSEMI LMV722M/TR LMV722M

ModelLMV722M/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LMV722M / TR
Type
HGSEMI
Minimum package
2500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LMV722M/TR
Electronic Component
1
Package
SOP-8
Electronic Component
Operational Amplifier
Electronic Component
0.407g
Electronic Component
1
Electronic Component
Output
Electronic Component
BM0264548637
Operating Temperature
40℃~+125℃
Amplifier
2
Output Current
70mA
(SR)
9V/us
Power Supply Voltage
2.1V~5.5V
Static Current(Iq)
1.1mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LMV722M/TR 产品概述

一、概述

LMV722M/TR 是华冠(HGSEMI)推出的一款双运算放大器器件,面向低电压、低噪声及低功耗应用场景。器件提供轨到轨输入与轨到轨输出能力,能够在较窄电源电压下实现大摆幅输出,并具备掉电禁用(shutdown)功能,使静态电流可降至近90 nA(掉电模式),常态每通道静态电流约为1.1 mA(在5 V时)。

二、主要电气特性

  • 放大器数:2
  • 最大电源宽度 (Vdd–Vss):7.5 V(注意:正常工作电压范围见下)
  • 单电源工作电压:2.1 V ~ 5.5 V
  • 双电源工作电压:±1.05 V ~ ±2.75 V(对称供电)
  • 增益带宽积(GBW):11 MHz
  • 压摆率(SR):9 V/μs
  • 最大输出电流:70 mA(短时驱动能力,具体取决于负载与散热条件)
  • 输入失调电压(Vos):4.6 mV;温漂(Vos TC):2.4 μV/℃(不同封装/测试条件下略有差异,请以最终数据手册为准)
  • 输入偏置/失调电流(Ib/Ios):约 1 pA
  • 输入电压噪声密度:约 8 nV/√Hz @10 kHz
  • 共模抑制比(CMRR):63 dB
  • 工作温度范围:-40 ℃ ~ +125 ℃
  • 封装:SOP-8

三、性能亮点与优势

  • 轨到轨输入/输出:输入共模范围覆盖接地,输出能驱动至电源轨附近,便于低电压系统中获取更大动态范围。
  • 低噪声与中等带宽:11 MHz 的 GBW 配合 8 nV/√Hz 的噪声密度,适合传感前端、滤波与信号调理应用。
  • 低输入偏置电流:pA 级别的输入偏置便于高阻抗传感器接口和精密采样电路。
  • 强驱动能力:70 mA 的输出能力支持驱动小型负载或电阻网络,适合驱动模拟开关、缓冲器等。
  • 低功耗与掉电功能:常态静态电流低,且具备掉电禁用使器件进入超低电流模式,便于电池供电系统节能管理。

四、典型应用

  • 传感器前端放大(温度、压力、光学传感器等)
  • 低功耗数据采集系统与电池供电设备
  • 有源滤波器、放大与缓冲电路
  • 精密比较放大、差分信号放大与接口驱动
  • 便携式医疗与测试设备

五、封装与产品选型建议

LMV722M/TR 采用 SOP-8 封装,适合表面贴装生产与批量组装。选型时应关注实际工作电源范围、温度与负载条件;若系统对输入失调和漂移有严格要求,请参考器件完整数据手册并在目标温度范围内评估失调性能。对需要超低漏电或更低噪声的场合,可比较同系列其它型号或采用后级补偿与滤波方案。

备注:文中参数基于器件典型规格与器件族资料整理,不同批次、封装或工作条件下的极限/最大值可能有所不同。出于设计可靠性考虑,请以华冠官方数据手册与典型应用电路为准进行最终设计验证。

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