WMSIC Electronic Components

HGSEMI MAX3485EIM/TR MAX3485EIM

ModelMAX3485EIM/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI MAX3485EIM / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
MAX3485EIM/TR
Electronic Component
1
Package
SOP-8
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.238g
Electronic Component
256
Electronic Component
1
Features
Tx / Rx;;;; Low Power
Electronic Component
BM0227582617
Operating Temperature
40℃~+85℃
Operating Voltage
3V~3.6V
Receiver
1
Data
12Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX3485EIM/TR 产品概述

一、产品简介

MAX3485EIM/TR 为一款低电压差分收发器,适用于半双工多点串行通信总线。器件包含1路驱动器与1路接收器,工作电压范围为3.0V~3.6V,支持最高12Mbps的数据速率,单片最多可支持256节点规模的网络拓扑,适合工业现场总线与长线通信场景。器件工作温度范围为-40℃至+85℃,低静态电流(典型520µA)使其在电源受限与待机场合具备良好能效表现。封装为SOP-8,品牌为HGSEMI(华冠)。器件对静电干扰具备高抗扰能力(描述值:15kV),提升系统鲁棒性。

二、主要特性

  • 单通道差分收发器:1个驱动器 + 1个接收器,适合点到点或多点半双工总线。
  • 供电电压:3.0V ~ 3.6V,兼容3.3V系统。
  • 数据速率:最高支持12Mbps,满足高速RS-485/RS-422类通信需求。
  • 网络规模:支持最多256个节点,适合多节点总线架构。
  • 低静态电流:典型值约520µA,有利于降低系统空载功耗。
  • 温度范围:工业级-40℃ ~ +85℃,适应恶劣环境。
  • ESD/抗扰:对静电放电与机械/线路干扰具备高耐受性(描述15kV)。
  • 通信模式:半双工(需外部方向控制信号),SOP-8 封装利于通用PCB布局与批量生产。

三、典型应用场景

  • 工业自动化现场总线(PLC、分布式I/O)
  • 楼宇设备与楼宇自控网络(电梯、安防、照明控制)
  • 电能计量与抄表集中器
  • 电机控制与伺服系统的远端通信
  • 工业传感器与数据采集系统(多节点长线传输)

四、典型电路与设计建议

  • 电源旁路:在VCC脚附近放置0.1µF陶瓷电容与必要的大容量滤波以抑制电源噪声,降低EMI。
  • 总线终端:在总线两端采用差分终端电阻(常见120Ω)以抑制反射,必要时增加浪涌抑制元件(TVS)以保护总线。
  • 偏置与失效安全:为保证空闲状态总线电平可定义,建议在总线两端或附近增加偏置电阻(pull-up / pull-down),以确保接收端在无驱动时不会漂移。
  • 方向控制:半双工模式下须正确驱动DE/RE(或等效)方向控制信号,注意驱动器与接收器切换的禁止/延迟时间,避免总线冲突。
  • 布线与屏蔽:差分对应紧邻布线,控制阻抗一致,尽量缩短差分对长度并靠近接地回流,长线场合考虑使用屏蔽线或通道隔离。
  • EMC与浪涌保护:在工业环境中建议选用传导/辐射抑制器件与适配的共模/差模滤波器,提高系统抗干扰能力。

五、封装、环境与可靠性

器件为SOP-8封装,便于自动化贴装与散热处理。工业温度等级(-40℃至+85℃)适应各类室外与工控环境。高抗静电能力(15kV)降低装配与现场维护过程中的损坏风险。实际系统设计中建议按照厂商推荐的PCB布局与焊接工艺进行,以保证长期可靠性。

六、选型与注意事项

  • 确认系统总线拓扑与节点数是否接近256的上限,若节点密集需关注终端和偏置设计。
  • 高速(接近12Mbps)传输时,PCB走线与终端匹配尤为关键,需控制差分对特性阻抗并缩短不必要的stub。
  • 半双工通信需配合上位机或主控的方向管理策略,避免总线冲突并确保时序正确。
  • 若工作环境存在高能脉冲或雷击风险,建议在收发器与外部总线之间加入TVS及额外保护电路。

总结:MAX3485EIM/TR(HGSEMI)是一款面向工业与多节点通信场合的低压差分收发器,集低功耗、高速率与良好抗扰性能于一体。合理的终端、偏置与PCB设计能充分发挥其在长线、多节点系统中的稳定通信能力。

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